Inventor
Hsien-Ju Tsou
Inventor
Taipei, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
10,879,194Semiconductor device package and method of manufacturing the same202010,586,763Semiconductor device and method of manufacture202010,510,732PoP device and method of forming the same201910,497,690Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly201910,269,589Method of manufacturing a release film as isolation film in package2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2019–2020Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2019–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 5 | 2019–2020 |