Inventor
Peng Su
Inventor
Guangdong, CN
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
LOC2325%
H01HElectric switches11%
H01LSemiconductor devices7%
H05KPrinted circuits7%
LOC147%
G01BMeasuring length, thickness or similar linear dimensions4%
G01MTesting static or dynamic balance of machines or structures4%
G01RMeasuring electric variables4%
H01FMagnets4%
PatentTitleYear
D0923759Sewer hose kit202110,588,213Apparatus, system, and method for precise heatsink alignment on circuit boards202010,312,043Sealed high voltage direct current relay201910,262,825Moving iron core guide mechanism for high voltage direct current relay201910,242,941Apparatus, system, and method for mitigating warpage of lidless integrated circuits during reflow processes201910,163,596Horizontal-deflection prevention mechanism for high voltage direct current relay2018D0820961Window air conditioner2018D0820421Window air conditioner2018D0820419Window air conditioner2018D0820420Window air conditioner2018D0819795Window air conditioner2018D0819794Window air conditioner2018D0808343'Remote controller'20189,068,904'System and method for non-contact metrology of surfaces'20158,623,707'Method of fabricating a semiconductor package with integrated substrate thermal slug'2014D0684994'Display screen with graphical user interface'20138,405,203'Semiconductor package with integrated substrate thermal slug'20137,821,104'Package device having crack arrest feature and method of forming'20107,622,309'Mechanical integrity evaluation of low-k devices with bump shear'20097,215,014'Solderable metal finish for integrated circuit package leads and method for forming'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2010Patents assigned to FREESCALE SEMICONDUCTOR INC (3)· patent assignee history
2007–2009Based in Austin, TX, US· patent location history
2010–2014Based in San Jose, CA, US· patent location history
2013–2014Patents assigned to CISCO TECH INC (2)· patent assignee history
2018Patents assigned to TCL AIR CONDITIONER ZHONGSHAN CO LTD (7)· patent assignee history
2018–2019Patents assigned to ZHEJIANG INNUOVO NEW ENERGY TECH CO LTD (3)· patent assignee history
2018Based in Guangdong, CN· patent location history
2018–2019Based in Dongyang, CN· patent location history
2019–2020Patents assigned to JUNIPER NETWORKS INC (2)· patent assignee history
2019–2020Based in Santa Clara, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TCL AIR CONDITIONER ZHONGSHAN CO LTD | 7 | 2018 |
| FREESCALE SEMICONDUCTOR INC | 3 | 2007–2010 |
| ZHEJIANG INNUOVO NEW ENERGY TECH CO LTD | 3 | 2018–2019 |
| CISCO TECH INC | 2 | 2013–2014 |
| JUNIPER NETWORKS INC | 2 | 2019–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Guangdong, CN | 7 | 2018 |
| Dongyang, CN | 3 | 2018–2019 |
| San Jose, California, US | 3 | 2010–2014 |
| Santa Clara, California, US | 2 | 2019–2020 |
| Austin, Texas, US | 2 | 2007–2009 |