Inventor

Masaharu Shirai

Inventor

Kusatsu, JP

Overview

22→

Patents

1976–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits29%

Y10TTechnical subjects covered by former us classification19%

G03GElectrography10%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%

C08JWorking-up2%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%

C08LCompositions of macromolecular compounds2%

C09JAdhesives2%

PatentTitleYear

11,133,459Magnetic element, magnetic memory device, and magnetic sensor2021 8,446,734'Circuit board and mounting structure'2013 8,129,623'Resin film, adhesive sheet, circuit board, and electronic apparatus'2012 8,012,561'Fiber-reinforced resin and method for manufacturing the same'2011 7,945,191'Image forming apparatus having external-additive removal unit that includes a conductive blade'2011 7,715,777'Image forming apparatus forming a developed image using an image carrier'2010 6,612,028'Method for manufacturing a built-up circuit board'2003 6,338,937'Lithography method and method for producing a wiring board'2002 6,048,465'Circuit board and fabrication method thereof'2000 5,998,739'Stepped configured circuit board'1999 5,784,781'Manufacturing process for organic chip carrier'1998 5,776,662'Method for fabricating a chip carrier with migration barrier, and resulating chip carrier'1998 5,766,825'Method of forming a resin laying in a surface laminated circuit'1998 5,537,740'Method of making printed circuit board'1996 5,517,756'Method of making substrate member having electrical lines and apertured insulating film'1996 5,510,580'Printed circuit board with landless blind hole for connecting an upper wiring pattern to a lower wiring pattern'1996 5,460,858'Method for forming a smooth-surfaced insulating layer'1995 5,403,692'Electrophotographic photoreceptor'1995 5,252,781'Substrate member having electric lines and apertured insulating film'1993 4,637,709'Apparatus for generating an image from within a sheet-like member'1987 4,571,052'Electric field transfer method and apparatus'1986 3,957,905'Fire retardant thermoplastic polyester type block copolymer composition'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1986–2011Patents assigned to FUJI XEROX CO LTD (5)· patent assignee history

1987–2011Based in Kanagawa, JP· patent location history

1993–2003Patents assigned to IBM (12)· patent assignee history

1993–1996Based in Ohtsu, JP· patent location history

1995–2010Based in Minami-ashigara, JP· patent location history

1998–2003Based in Kusatsu, JP· patent location history

2011–2013Patents assigned to KYOCERA CORP (3)· patent assignee history

2012–2013Patents assigned to SHIRAI MASAHARU (2)· patent assignee history

2012–2013Patents assigned to TSUKADA YUTAKA (2)· patent assignee history

2012–2013Based in Yasu, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	12	1993–2003
FUJI XEROX CO LTD	5	1986–2011
KYOCERA CORP	3	2011–2013
SHIRAI MASAHARUself	2	2012–2013
TSUKADA YUTAKA	2	2012–2013

Locations

Location	Patents	Span
Kusatsu, JP	7	1998–2003
Ohtsu, JP	5	1993–1996
Yasu, JP	2	2012–2013
Kanagawa, JP	2	1987–2011
Minami-ashigara, JP	2	1995–2010