Inventor
XIAOBO SHI
Inventor
US
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Gprimary
C09GPolishing compositions21%
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C09KMaterials for miscellaneous applications, not provided for elsewhere19%
B24BMachines, devices, or processes for grinding or polishing10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
C23FNon-mechanical removal of metallic material from surface2%
PatentTitleYear
12,516,421Barrier chemical mechanical planarization slurries for cobalt films202612,234,383Low dishing oxide CMP polishing compositions for shallow trench isolation applications and methods of making thereof202512,091,581High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishing202411,718,767Chemical mechanical planarization composition for polishing oxide materials and method of use thereof202311,692,110Low oxide trench dishing chemical mechanical polishing202311,667,839Low oxide trench dishing chemical mechanical polishing202311,643,599Tungsten chemical mechanical polishing for reduced oxide erosion202311,608,451Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates202311,549,034Oxide chemical mechanical planarization (CMP) polishing compositions202311,401,441Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications202211,326,076Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives202211,254,839Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing202211,180,678Suppressing SiN removal rates and reducing oxide trench dishing for Shallow Trench Isolation (STI) process2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to VERSUM MAT US LLC (13)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| VERSUM MAT US LLC | 13 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 13 | 2021–2026 |