LexDanaLexDanabeta
Inventor

Ronilo Boja

Inventor
Gilroy, CA, US

Overview

6→
Patents
1995–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01LSemiconductor devices27%
H05KPrinted circuits18%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials9%
Y10TTechnical subjects covered by former us classification9%
PatentTitleYear
10,764,996Chip package assembly with composite stiffener202010,438,863Chip package assembly with surface mounted component protection201910,219,387Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate20199,659,815'System, method, and computer program product for a cavity package-on-package structure'20178,810,028'Integrated circuit packaging devices and methods'20145,381,641'BGA funnel'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995Patents assigned to ADVANCED MICRO DEVICES INC (1)· patent assignee history
1995–2014Based in San Jose, CA, US· patent location history
2014–2020Patents assigned to XILINX INC (3)· patent assignee history
2014Patents assigned to BOJA RONILO (1)· patent assignee history
2014Patents assigned to NAGARAJAN KUMAR (1)· patent assignee history
2017–2019Patents assigned to NVIDIA CORP (2)· patent assignee history
2017–2020Based in Gilroy, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
XILINX INC32014–2020
NVIDIA CORP22017–2019
ADVANCED MICRO DEVICES INC11995
BOJA RONILOself12014
NAGARAJAN KUMAR12014
Locations
LocationPatentsSpan
Gilroy, California, US42017–2020
San Jose, California, US21995–2014