Inventor
VIVEK ARORA
Inventor
US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices29%
H01FMagnets13%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems8%
H04NPictorial communication, e.g. television4%
H05KPrinted circuits4%
H10DInorganic electric semiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
12,482,718Thermally enhanced embedded die package202512,482,711Half bridge ceramic hermetic package structure202512,456,707Stacked clip design for GaN half bridge IPM202512,400,939Packaged semiconductor device including heat slug202511,908,834Multi-chip package with reinforced isolation202411,870,341Isolated power converter package with molded transformer202411,765,405Categorizing live stream of content202311,417,579Packaged semiconductor devices for high voltage with die edge protection202211,329,025Multi-chip package with reinforced isolation2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TEXAS INSTRUMENTS INC (8)· patent assignee history
2022–2025Based in US· patent location history
2023Patents assigned to COMSCORE INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 8 | 2022–2025 |
| COMSCORE INC | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 9 | 2022–2025 |