Inventor
Ying-feng PANG
Inventor
US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H01LSemiconductor devices14%
G01MTesting static or dynamic balance of machines or structures10%
G06FElectric digital data processing10%
B05BSpraying apparatus5%
F25BRefrigeration machines, plants or systems5%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
G01RMeasuring electric variables5%
G05DSystems for controlling or regulating non-electric variables5%
PatentTitleYear
12,578,742Methods and apparatus for an autonomous stage-switching multi-stage cooling device202612,543,567Tunable stack-up DIMM form factor cold plate with embedded peltier devices for enhanced cooling capability202612,500,137Directly impinging pressure modulated spray cooling and methods of target temperature control202512,442,712Liquid cooling system leak detection improvements202512,424,513Technologies for isolated heat dissipating devices202512,213,288Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips202512,169,180Optical leak detection of liquid cooling components within an electronic system202411,917,790Thermal control for processor-based devices2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2026Patents assigned to INTEL CORP (8)· patent assignee history
2024–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 8 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 8 | 2024–2026 |