Inventor

Günter Waitl

Inventor

Regensburg, DE

Overview

1999–2015

Patent span

Electricity

Primary field (CPC H)

Patents· 55 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%

H10HInorganic light-emitting semiconductor devices having potential barriers27%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%

C09KMaterials for miscellaneous applications, not provided for elsewhere7%

Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications5%

F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted4%

G02BOptical elements, systems or apparatus3%

F21VFunctional features or details of lighting devices or systems thereof2%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%

F21SNon-portable lighting devices2%

PatentTitleYear

9,196,800'Light-radiating semiconductor component with a luminescence conversion element'2015 8,525,206'Illumination device'2013 8,511,855'Configuration of multiple LED module'2013 8,227,821'Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component'2012 8,113,688'Configuration of multiple LED module'2012 8,110,437'Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof'2012 8,097,937'Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component'2012 8,003,998'Light-emitting diode arrangement'2011 7,995,882'Lighting device comprising a plurality of semiconductor light sources'2011 7,948,694'Apparatus for an optoelectronic device and componnent having an optoelectronic device and an apparatus'2011 7,880,188'Illumination device'2011 7,862,211'Configuration of multiple LED modules'2011 7,838,357'Optoelectronic component'2010 7,718,451'Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body'2010 7,696,590'Diode housing'2010 7,688,400'Light source element with lateral, angular light injection'2010 7,688,401'Light source element with lateral, oblique light infeed'2010 7,675,132'Surface mounting optoelectronic component and method for producing same'2010 7,629,621'Light-radiating semiconductor component with a luminescence conversion element'2009 7,601,550'Methods for producing a light emitting semiconductor body with a luminescence converter element'2009 7,510,888'LED arrangement'2009 7,488,622'Method for producing a surface-mountable semiconductor component'2009 7,456,500'Light source module and method for production thereof'2008 7,446,347'Optoelectronic component and method for the production thereof, module and device comprising a module of this type'2008 7,439,549'LED module'2008 7,435,997'Component comprising a large number of light-emitting-diode chips'2008 7,427,806'Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component'2008 7,407,303'Lighting device comprising a plurality of semiconductor light sources'2008 7,345,317'Light-radiating semiconductor component with a luminescene conversion element'2008 7,288,606'Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities'2007 7,271,425'Optoelectronic component'2007 7,261,837'Arrangement of luminescent materials, wavelength-converting casting compound and light source'2007 7,262,437'Radiation source and method for producing a lens mould'2007 7,247,940'Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body'2007 7,208,769'LED arrangement'2007 7,199,470'Surface-mountable semiconductor component and method for producing it'2007 7,199,454'Optoelectronic semiconductor component'2007 7,193,299'Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components'2007 7,151,283'Light-radiating semiconductor component with a luminescence conversion element'2006 7,132,786'Luminescent array, wavelength-converting sealing material and light source'2006 7,126,162'Light-radiating semiconductor component with a luminescence conversion element'2006 7,078,732'Light-radiating semiconductor component with a luminescence conversion element'2006 7,009,008'Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities'2006 6,998,771'Arrangement of luminescent materials, wavelength-converting casting compound and light source'2006 6,975,011'Optoelectronic semiconductor component having multiple external connections'2005 6,946,714'Surface mounting optoelectronic component and method for producing same'2005 6,927,469'Surface mountable light emitting or receiving device'2005 6,812,500'Light-radiating semiconductor component with a luminescence conversion element'2004 6,610,563'Surface mounting optoelectronic component and method for producing same'2003 6,576,930'Light-radiating semiconductor component with a luminescence conversion element'2003 6,560,857'Assembly device'2003 6,459,130'Optoelectronic semiconductor component'2002 RE037554'Method for producing an optoelectronic semiconductor component'2002 6,299,337'Flexible multiple led module, in particular for a luminaire housing of a motor vehicle'2001 5,985,696'Method for producing an optoelectronic semiconductor component'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2002Patents assigned to SIEMENS AG (3)· patent assignee history

1999–2015Based in Regensburg, DE· patent location history

2001–2013Patents assigned to OSRAM OPTO SEMICONDUCTORS GMBH (25)· patent assignee history

2005–2015Patents assigned to OSRAM GMBH (25)· patent assignee history

2012Patents assigned to BOGNER GEORG (3)· patent assignee history

2012Patents assigned to HIEGLER MICHAEL (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
OSRAM GMBH	25	2005–2015
OSRAM OPTO SEMICONDUCTORS GMBH	25	2001–2013
BOGNER GEORG	3	2012
HIEGLER MICHAEL	3	2012
SIEMENS AG	3	1999–2002

Locations

Location	Patents	Span
Regensburg, DE	55	1999–2015