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Inventor

CHEN-HSUAN YEN

Inventor
TW

Overview

3→
Patents
2023–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems14%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock14%
PatentTitleYear
12,230,550Structures and methods for heat dissipation of semiconductor devices202512,122,665Micro-electromechanical system device using a metallic movable part and methods for forming the same202411,658,088Structures and methods for heat dissipation of semiconductor devices2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2023–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32023–2025
Locations
LocationPatentsSpan
TW32023–2025