Inventor

James C. Matayabas, Jr.

Inventor

Chandler, AZ, US

Overview

1995–2020

Patent span

Chemistry

Primary field (CPC C)

Patents· 74 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients14%

Y10TTechnical subjects covered by former us classification11%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds10%

H01LSemiconductor devices7%

B82YSpecific uses or applications of nanostructures6%

C08LCompositions of macromolecular compounds5%

C01BNon-metallic elements3%

H05KPrinted circuits3%

B23KSoldering or unsoldering2%

PatentTitleYear

10,586,779LPS solder paste based low cost fine pitch pop interconnect solutions2020 10,580,717Multiple-chip package with multiple thermal interface materials2020 10,056,314Polymer thermal interface material having enhanced thermal conductivity2018 10,049,971Package structure to enhance yield of TMI interconnections2018 9,950,393Hybrid low metal loading flux2018 9,941,652Space transformer with perforated metallic plate for electrical die test2018 9,831,206LPS solder paste based low cost fine pitch pop interconnect solutions2017 9,640,415'Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials'2017 9,631,065'Methods of forming wafer level underfill materials and structures formed thereby'2017 9,613,933'Package structure to enhance yield of TMI interconnections'2017 9,070,660'Polymer thermal interface material having enhanced thermal conductivity'2015 8,920,919'Thermal interface material composition including polymeric matrix and carbon filler'2014 8,900,919'Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials'2014 8,901,716'Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin'2014 8,431,223'Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications'2013 8,431,673'Radiation curable compositions'2013 8,242,216'Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications'2012 7,999,042'Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications'2011 7,816,171'Component packaging apparatus, systems, and methods'2010 7,794,623'Microelectronic device having liquid crystalline epoxy resins'2010 7,744,802'Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin'2010 7,723,160'Thermal interface structure with integrated liquid cooling and methods'2010 7,700,943'In-situ functionalization of carbon nanotubes'2010 7,671,120'Chain extension for thermal materials'2010 7,666,768'Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance'2010 7,465,605'In-situ functionalization of carbon nanotubes'2008 7,446,360'Polymer device with a nanocomposite barrier layer'2008 7,421,780'Methods for fabricating thermal management systems for micro-components'2008 7,417,111'Liquid crystalline epoxy resins'2008 7,408,787'Phase change thermal interface materials including polyester resin'2008 7,365,414'Component packaging apparatus, systems, and methods'2008 7,332,797'Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold'2008 7,327,027'Thermal interface structure with integrated liquid cooling and methods'2008 7,179,689'Package stress management'2007 7,170,188'Package stress management'2007 7,141,454'Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold'2006 7,126,215'Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist'2006 7,060,747'Chain extension for thermal materials'2006 7,030,483'Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application'2006 7,030,485'Thermal interface structure with integrated liquid cooling and methods'2006 7,019,971'Thermal management systems for micro-components'2006 6,974,728'Encapsulant mixture having a polymer bound catalyst'2005 6,974,723'Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials'2005 6,924,027'Phase change thermal interface materials including exfoliated clay'2005 6,841,867'Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials'2005 6,777,479'Polyamide nanocomposites with oxygen scavenging capability'2004 6,713,547'Process for preparing high barrier nanocomposites'2004 6,653,388'Polymer/clay nanocomposite comprising a clay mixture and a process for making same'2003 6,597,575'Electronic packages having good reliability comprising low modulus thermal interface materials'2003 6,552,113'Polymer-clay nanocomposite comprising an amorphous oligomer'2003 6,552,114'Process for preparing a high barrier amorphous polyamide-clay nanocomposite'2003 6,548,587'Polyamide composition comprising a layered clay material modified with an alkoxylated onium compound'2003 6,486,253'Polymer/clay nanocomposite having improved gas barrier comprising a clay material with a mixture of two or more organic cations and a process for preparing same'2002 6,486,252'Nanocomposites for high barrier applications'2002 6,486,254'Colorant composition, a polymer nanocomposite comprising the colorant composition and articles produced therefrom'2002 6,469,379'Chain extension for thermal materials'2002 6,417,262'High barrier amorphous polyamide-clay nanocomposite and a process for preparing same'2002 6,391,449'Polymer/clay intercalates, exfoliates, and nanocomposites comprising a clay mixture and a process for making same'2002 6,387,996'Polymer/clay intercalates, exfoliates; and nanocomposites having improved gas permeability comprising a clay material with a mixture of two or more organic cations and a process for preparing same'2002 6,384,121'Polymeter/clay nanocomposite comprising a functionalized polymer or oligomer and a process for preparing same'2002 6,376,591'High barrier amorphous polyamide-clay intercalates, exfoliates, and nanocomposite and a process for preparing same'2002 6,084,019'High I.V. polyester compositions containing platelet particles'2000 6,071,988'Polyester composite material and method for its manufacturing'2000 6,034,163'Polyester nanocomposites for high barrier applications'2000 5,652,328'Polyether polymers derived from 3,4-epoxy-1-butene and hydroxyl initiator'1997 H0001669'Copolyester-ether polymers'1997 5,608,117'Process for producing saturated polyether glycols and alcohols derived from 3, 4-epoxy-1-butene'1997 5,608,034'Polyether polymers derived from 3,4-epoxy-1-butene'1997 5,536,809'Polyether glycols and alcohols derived form 3,4-epoxy-1-butene, tetrahydrofuran and an initiator'1996 5,536,882'Preparation of polyether glycols and alcohols by the polymerization 3,4-epoxy-1-butene'1996 5,502,137'Polyether glycols and alcohols derived from 3,4-epoxy-1-butene, tetrahydrofuran and an initiator'1996 5,466,759'Polyether glycols and alcohols derived from 3,4-epoxy-1-butene'1995 5,434,314'Polyether glycols and alcohols derived from 3,4-epoxy-1-butene'1995 5,393,867'Polyether polymers derived from 3,4-epxoy-1-butene'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2004Patents assigned to EASTMAN CHEM CO (16)· patent assignee history

1995–2004Based in Kingsport, TN, US· patent location history

2002–2020Patents assigned to INTEL CORP (46)· patent assignee history

2002–2004Patents assigned to UNIV SOUTH CAROLINA RES FOUND (7)· patent assignee history

2002Patents assigned to AMCOL INTERNATIONAL CORP (3)· patent assignee history

2002–2018Based in Chandler, AZ, US· patent location history

2002Based in Phoenix, AZ, US· patent location history

2012–2018Patents assigned to MATAYABAS JR JAMES C (7)· patent assignee history

2015–2020Based in Gilbert, AZ, US· patent location history

2017–2018Based in Gilber, AZ, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INTEL CORP	46	2002–2020
EASTMAN CHEM CO	16	1995–2004
MATAYABAS JR JAMES Cself	7	2012–2018
UNIV SOUTH CAROLINA RES FOUND	7	2002–2004
AMCOL INTERNATIONAL CORP	3	2002

Locations

Location	Patents	Span
Chandler, AZ, US	46	2002–2018
Kingsport, TN, US	15	1995–2004
Gilbert, AZ, US	6	2015–2020
Gilber, AZ, US	3	2017–2018
Phoenix, AZ, US	3	2002