Inventor
YI-LII HUANG
Inventor
TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01LSemiconductor devices27%
H10DInorganic electric semiconductor devices27%
B82YSpecific uses or applications of nanostructures9%
PatentTitleYear
12,317,554Contact structures for semiconductor devices202512,046,677Contact for semiconductor device and method of forming thereof202411,652,171Contact for semiconductor device and method of forming thereof202311,532,559Semiconductor device and method for making the semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 4 | 2022–2025 |