Inventor

Toshiaki Aoai

Inventor

Shizuoka, JP

Overview

1985–2020

Patent span

Physics

Primary field (CPC G)

Patents· 109 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices36%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests28%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%

C07CAcyclic or carbocyclic compounds3%

Y10TTechnical subjects covered by former us classification3%

C07DHeterocyclic compounds2%

C09DCoating compositions, e.g. paints, varnishes or lacquers2%

B41CProcesses for the manufacture or reproduction of printing surfaces2%

H01LSemiconductor devices2%

B82YSpecific uses or applications of nanostructures1%

PatentTitleYear

10,580,953Thermoelectric conversion element, thermoelectric conversion module, method for manufacturing thermoelectric conversion element, and method for manufacturing thermoelectric conversion module2020 10,243,128Thermoelectric conversion element and thermoelectric conversion module2019 9,445,501'Electrically conductive composition, electrically conductive film using the composition and a method of producing the same'2016 9,356,217'Electrically conductive composition, an electrically conductive film using the composition and a method of producing the same'2016 8,685,614'Positive photosensitive composition'2014 8,304,083'Hydrophilic member and process for producing the same'2012 RE043560'Positive photosensitive compositions'2012 7,812,194'Positive photosensitive composition'2010 7,776,512'Positive photosensitive composition'2010 7,709,550'Ink composition, inkjet recording method, printed material, process for producing lithographic printing plate, and lithographic printing plate'2010 7,690,301'Ink composition, inkjet recording method, printed material, production method of a planographic printing plate and planographic printing plate'2010 7,538,149'Ink composition, inkjet recording method, printed material, process for producing lithographic printing plate, and lithographic printing plate'2009 7,435,526'Positive photosensitive composition'2008 7,244,543'Lithographic printing starting plate'2007 7,223,516'Positive type photoresist composition'2007 7,138,217'Positive resist composition'2006 7,018,774'Infrared sensitive composition and lithographic printing plate precursor'2006 6,962,766'Positive photoresist composition'2005 6,852,467'Positive resist composition'2005 6,846,610'Positive photosensitive resin composition'2005 6,844,132'Positive photosensitive compositions'2005 6,824,948'Electron beam or X-ray negative-working resist composition'2004 6,818,377'Positive photosensitive composition'2004 6,808,860'Positive photoresist composition'2004 6,806,022'Positive photosensitive resin composition'2004 6,794,108'Positive photoresist composition for far ultraviolet exposure'2004 6,790,970'(Meth) acrylic acid ester compound'2004 6,787,283'Positive photoresist composition for far ultraviolet exposure'2004 6,749,987'Positive photosensitive composition'2004 6,720,128'Positive resist composition'2004 6,699,635'Positive photosensitive composition'2004 6,692,884'Positive photoresist composition'2004 6,670,095'Positive-working resist composition'2003 6,638,683'Positive photoresist composition'2003 6,632,586'Positive resist composition'2003 6,602,646'Positive-working resist composition'2003 6,596,458'Positive-working photoresist composition'2003 6,576,392'Positive photoresist composition'2003 6,544,715'Positive photoresist composition for far ultraviolet ray exposure'2003 6,517,991'Positive photosensitive composition'2003 6,492,091'Positive photosensitive composition'2002 6,485,883'Positive photoresist composition'2002 6,479,209'Positive photosensitive composition'2002 6,479,211'Positive photoresist composition for far ultraviolet exposure'2002 6,420,082'Positive resist fluid and positive resist composition'2002 6,416,925'Positive working photosensitive composition'2002 6,410,204'Positive photoresist composition'2002 6,379,860'Positive photosensitive composition'2002 6,291,130'Positive photosensitive composition'2001 6,265,135'Positive-working electron beam or X-ray resist composition'2001 6,245,485'Positive resist composition'2001 6,242,153'Positive photoresist composition for far ultraviolet ray exposure'2001 6,238,842'Positive photosensitive composition'2001 6,214,517'Positive photoresist composition'2001 6,200,729'Positive photosensitive composition'2001 6,159,656'Positive photosensitive resin'2000 6,150,068'Photosensitive resin composition for far-ultraviolet exposure'2000 6,136,504'Positive-working photoresist composition'2000 6,042,991'Positive working photosensitive composition'2000 6,037,098'Positive photosensitive composition'2000 6,013,411'Positive working photosensitive composition'2000 6,010,820'Positive photosensitive composition'2000 6,004,721'Positive photoresist composition'1999 5,981,140'Positive photosensitive composition'1999 5,955,238'Waterless planographic printing plate and method of plate making using the same'1999 5,945,250'Positive photosensitive composition'1999 5,939,234'Chemically amplified positive resist composition'1999 5,891,603'Positive working photosensitive composition'1999 5,837,420'Positive working photosensitive composition'1998 5,824,451'Positive photosensitive composition'1998 5,707,776'Positive resin composition sensitive to ultraviolet rays'1998 5,707,777'Light-sensitive composition'1998 5,700,620'Radiation ray sensitive resin compostion containing at least two different naphthoquinonediazide sulfonic acid esters and an alkali-soluble low-molecular compound'1997 5,693,452'Positive chemically amplified resist composition'1997 5,683,856'Positive-working photosensitive composition'1997 5,609,982'Positive-working photoresist composition'1997 5,576,143'Light-sensitive composition'1996 5,554,481'Positive working photoresist composition'1996 5,529,881'Postive photoresist composition'1996 5,523,396'Process for synthesizing quinonediazide ester utilizing base catalyst'1996 5,340,688'Positive type photoresist composition'1994 5,338,640'Siloxane polymers and positive working light-sensitive compositions comprising the same'1994 5,320,928'Photosensitive composition comprising a diazonium compound and a polyurethane'1994 5,318,875'Positive quinonediazide photoresist composition containing select hydroxyphenol additive'1994 5,294,511'Photosensitive composition'1994 5,278,273'Siloxane polymers and positive working light-sensitive compositions comprising the same'1994 5,276,124'Siloxane polymers and positive working light-sensitive compositions comprising the same'1994 5,254,432'Photosensitive composition'1993 5,252,686'Siloxane polymers and positive working light-sensitive compositions comprising the same'1993 5,216,105'Silicone polymers and positive working light-sensitive compositions comprising the same'1993 5,204,217'Photosensitive composition'1993 5,143,816'Light-sensitive composition comprising a polysiloxane and a naphthoquinone'1992 5,141,840'Light-sensitive composition containing onium salt and polysiloxane reaction product'1992 5,110,709'Light-sensitive positive working composition containing a pisolfone compound'1992 5,069,992'Electrophotographic printing plate precursor containing alkali-soluble polyurethane resin as binder resin'1991 5,002,853'Positive working photosensitive composition'1991 4,983,491'Photosensitive diazo resin composition with polyurethane resin having carboxyl group in its main chain'1991 4,950,582'Light-sensitive composition'1990 4,904,563'Microcapsules and light-sensitive recording material using the same'1990 4,898,803'Light-sensitive o-quinone diazide composition with acidic polyurethane resin'1990 4,877,711'Light-sensitive diazo photopolymerizable composition with polyurethane having carbon-carbon unsaturated and a carboxyl group'1989 4,842,986'Positively working resist material'1989 4,820,607'Photosolubilizable composition'1989 4,816,375'Photosolubilizable composition with silyl ether or silyl ester compound'1989 4,786,577'Photo-solubilizable composition admixture with radiation sensitive acid producing compound and silyl ether group containing compound with either urethane, ureido, amido, or ester group'1988 4,766,037'Photodegradable microcapsules'1988 4,752,552'Photosolubilizable composition'1988 4,741,985'Light-sensitive composition comprising a diazonium salt condensate and a modified polyvinyl acetal polymer.'1988 4,536,464'Photosensitive composition with o-quinonediazide compound and condensate of dihydric phenol and aldehyde or ketone'1985

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1985–2006Patents assigned to FUJI PHOTO FILM CO LTD (94)· patent assignee history

1985–2012Based in Kanagawa, JP· patent location history

1989–2014Based in Shizuoka, JP· patent location history

1991Based in Sizuoka, JP· patent location history

1998Based in Haibara-gun, JP· patent location history

2007–2020Patents assigned to FUJIFILM CORP (15)· patent assignee history

2012–2014Patents assigned to AOAI TOSHIAKI (3)· patent assignee history

2012–2014Patents assigned to KODAMA KUNIHIKO (2)· patent assignee history

2012Patents assigned to HOSHI SATOSHI (1)· patent assignee history

2016–2020Based in Ashigarakami-gun, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FUJI PHOTO FILM CO LTD	94	1985–2006
FUJIFILM CORP	15	2007–2020
AOAI TOSHIAKIself	3	2012–2014
KODAMA KUNIHIKO	2	2012–2014
HOSHI SATOSHI	1	2012

Locations

Location	Patents	Span
Shizuoka, JP	94	1989–2014
Kanagawa, JP	9	1985–2012
Ashigarakami-gun, JP	4	2016–2020
Haibara-gun, JP	1	1998
Sizuoka, JP	1	1991