Inventor
CHIA-YU PENG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H05KPrinted circuits22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
PatentTitleYear
12,369,250Circuit board structure and manufacturing method thereof202512,266,616Integrated circuit package structure202512,160,953Circuit board structure and manufacturing method thereof202411,824,012Integrated circuit package structure and method of manufacturing the same202311,764,120Chip packaging structure and manufacturing method thereof202311,710,690Package structure and manufacturing method thereof202311,682,612Package structure and manufacturing method thereof202311,665,832Circuit board structure and manufacturing method thereof202311,516,910Circuit board structure and manufacturing method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to UNIMICRON TECHNOLOGY CORP (9)· patent assignee history
2022–2025Based in TW· patent location history
2023Patents assigned to UNIMICRON TECH CORPORATION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNIMICRON TECHNOLOGY CORP | 9 | 2022–2025 |
| UNIMICRON TECH CORPORATION | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2025 |