Inventor
Satoru Amou
Inventor
Hitachi, JP
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits16%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients13%
Y10TTechnical subjects covered by former us classification12%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
C08LCompositions of macromolecular compounds6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
C08JWorking-up3%
PatentTitleYear
9,493,605'Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured product'20169,090,796'Organic-inorganic composite materials containing triazine rings and electrical devices using the same'20159,034,475'Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same'20159,028,970'Adhesive composition, varnish, adhesive film and wiring film'20158,735,724'Electric equipment having insulation structure at welding parts'20148,685,872'Low softening point glass composition, bonding material using same and electronic parts'20148,507,592'Adhesive composition, adhesive film and wiring film using the same'20138,470,723'Low softening point glass composition, bonding material using same and electronic parts'20138,420,210'Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof'20138,227,361'Prepreg and printed wiring board using thin quartz glass cloth'20128,115,105'Prepreg and its application products for low thermal expansion and low dielectric tangent'20128,097,545'Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition'20127,638,564'Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish'20097,375,155'Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof'20087,294,905'Thin film capacitor and electronic circuit component'20077,273,900'Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof'20077,193,009'Electronic device using low dielectric loss tangent insulators for high frequency signals'20077,112,627'Low dielectric loss tangent films and wiring films'20066,930,140'Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof'20056,855,952'Semiconductor device and semiconductor package'20056,756,441'Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof'20046,306,481'Multilayer circuit board having insulating layer with via-holes'20016,190,834'Photosensitive resin composition, and multilayer printed circuit board using the same'20015,914,216'Multilayer circuit board and photosensitive resin composition used therefor'19995,565,536'Polymerizable compouund, process for producing same and setting composition containing polymerizable compound'19965,410,069'Polymerizable compound, process for producing same and setting composition containing polymerizable compound'19955,071,824'Heat transfer sheet, method for producing it, and method of heat transfer'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2015Patents assigned to HITACHI LTD (15)· patent assignee history
1991–2015Based in Hitachi, JP· patent location history
1999–2014Patents assigned to HITACHI CHEMICAL CO LTD (10)· patent assignee history
2012–2014Patents assigned to AMOU SATORU (7)· patent assignee history
2012Patents assigned to HANAWA AKINORI (3)· patent assignee history
2013–2015Patents assigned to HITACHI CABLE (3)· patent assignee history
2016Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 15 | 1991–2015 |
| HITACHI CHEMICAL CO LTD | 10 | 1999–2014 |
| AMOU SATORUself | 7 | 2012–2014 |
| HANAWA AKINORI | 3 | 2012 |
| HITACHI CABLE | 3 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hitachi, JP | 26 | 1991–2015 |
| Tokyo, JP | 1 | 2016 |