Inventor
Kathleen A. Stalter
Inventor
Hopewell Junction, NY, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H05KPrinted circuits24%
Y02PClimate change mitigation technologies in the production or processing of goods19%
Y10TTechnical subjects covered by former us classification14%
B23KSoldering or unsoldering10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
H01RElectrically-conductive connections1%
PatentTitleYear
6,984,792'Dielectric interposer for chip to substrate soldering'20066,657,313'Dielectric interposer for chip to substrate soldering'20036,584,684'Method for assembling a carrier and a semiconductor device'20036,559,527'Process for forming cone shaped solder for chip interconnection'20036,548,909'Method of interconnecting electronic components using a plurality of conductive studs'20036,360,938'Process and apparatus to remove closely spaced chips on a multi-chip module'20026,300,164'Structure, materials, and methods for socketable ball grid'20016,297,559'Structure, materials, and applications of ball grid array interconnections'20016,283,359'Method for enhancing fatigue life of ball grid arrays'20016,278,184'Solder disc connection'20016,270,363'Z-axis compressible polymer with fine metal matrix suspension'20016,258,625'Method of interconnecting electronic components using a plurality of conductive studs'20016,253,986'Solder disc connection'20016,220,499'Method for assembling a chip carrier to a semiconductor device'20016,218,629'Module with metal-ion matrix induced dendrites for interconnection'20016,216,937'Process and apparatus to remove closely spaced chips on a multi-chip module'20016,184,062'Process for forming cone shaped solder for chip interconnection'20016,158,644'Method for enhancing fatigue life of ball grid arrays'20006,120,885'Structure, materials, and methods for socketable ball grid'20006,070,321'Solder disc connection'20005,975,409'Ceramic ball grid array using in-situ solder stretch'19995,968,670'Enhanced ceramic ball grid array using in-situ solder stretch with spring'19995,964,396'Enhanced ceramic ball grid array using in-situ solder stretch with clip'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2006Patents assigned to IBM (23)· patent assignee history
1999–2006Based in Hopewell Junction, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 23 | 1999–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hopewell Junction, New York, US | 23 | 1999–2006 |