Inventor
Yoshikazu Sakano
Inventor
Obu, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1050%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests25%
H10DInorganic electric semiconductor devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
6,521,538'Method of forming a trench with a rounded bottom in a semiconductor device'20036,090,718'Dry etching method for semiconductor substrate'20005,871,659'Dry etching process for semiconductor'19995,522,966'Dry etching process for semiconductor'19965,423,941'Dry etching process for semiconductor'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–1999Patents assigned to NIPPON DENSO CO (3)· patent assignee history
1995Based in Chita, JP· patent location history
1996–1999Based in Chita-gun, JP· patent location history
2000–2003Patents assigned to DENSO CORP (2)· patent assignee history
2000–2003Based in Obu, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NIPPON DENSO CO | 3 | 1995–1999 |
| DENSO CORP | 2 | 2000–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Obu, JP | 2 | 2000–2003 |
| Chita-gun, JP | 2 | 1996–1999 |
| Chita, JP | 1 | 1995 |