Inventor
Kunsil Lee
Inventor
Hwaseong-si, KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices27%
H10DInorganic electric semiconductor devices20%
H05KPrinted circuits7%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
PatentTitleYear
10,825,710Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same202010,665,571Semiconductor package202010,256,215Semiconductor package20199,941,252Semiconductor package20186,395,982'Leaded semiconductor device package for use in nonsoldering assembling'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002Based in Taipei, TW· patent location history
2018–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (4)· patent assignee history
2018–2020Based in Hwaseong-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 4 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hwaseong-si, KR | 4 | 2018–2020 |
| Taipei, TW | 1 | 2002 |