Inventor

Robert W. Warren

Inventor
Loveland, CO, US

Overview

51→
Patents
1998–2018
Patent span
Physics
Primary field (CPC G)

Patents· 51 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
G06FElectric digital data processing16%
G11CStatic stores11%
G11BInformation storage based on relative movement between record carrier and transducer8%
H01LSemiconductor devices6%
Y10TTechnical subjects covered by former us classification5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
H04LTransmission of digital information, e.g. telegraphic communication3%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
PatentTitleYear
9,955,5823-D stacking of active devices over passive devices20189,230,928'Spot plated leadframe and IC bond pad via array design for copper wire'20169,142,491'Semiconductor package with corner pins'20159,054,115'Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding'20159,041,168'Overmolded semiconductor package with wirebonds for electromagnetic shielding'20159,029,991'Semiconductor packages with reduced solder voiding'20158,892,820'Method and system for local caching of remote storage data'20148,745,449'Systems and methods for managing end of life in a solid state drive'20148,693,126'Ultra fast disk access using arrays of fixed read/write transducers'20148,560,765'Systems and methods for variable level use of a multi-level flash memory'20138,552,540'Wafer level package with thermal pad for higher power dissipation'20138,540,529'Shielded USB connector module with molded hood and LED light pipe'20138,499,199'GPU computational assist for drive media waveform generation of media emulators'20138,499,220'Systems and methods for re-designating memory regions as error code corrected memory regions'20138,458,416'Systems and methods for selecting bit per cell density of a memory cell based on data typing'20138,455,990'Systems and methods of tamper proof packaging of a semiconductor device'20138,399,972'Overmolded semiconductor package with a wirebond cage for EMI shielding'20138,377,731'Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds'20138,381,077'Systems and methods for implementing error correction in relation to a flash memory'20138,301,195'Systems and methods for mobile data storage and acquisition'20128,289,768'Systems and methods for extended life multi-bit memory cells'20128,286,018'Power management in data storage device determining utilization of a control circuit by its rate of command processing'20128,285,892'Quantum burst arbiter and memory controller'20128,243,536'Systems and methods for increasing bit density in a memory cell'20128,243,546'Systems and methods for peak power and/or EMI reduction'20128,176,367'Systems and methods for managing end of life in a solid state drive'20128,174,912'Systems and methods for circular buffering control in a memory device'20128,151,137'Systems and methods for governing the life cycle of a solid state drive'20128,071,431'Overmolded semiconductor package with a wirebond cage for EMI shielding'20118,022,490'Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds'20118,024,490'Method and system for generic data transfer interface'20118,013,440'Enhanced thermal dissipation ball grid array package'20117,923,842'GaAs integrated circuit device and method of attaching same'20117,679,852'Adjustment of read/write clock edge timing'20107,635,606'Wafer level package with cavities for active devices'20097,629,201'Method for fabricating a wafer level package with device wafer and passive component integration'20097,613,088'Method and system for time based file storage'20097,576,426'Wafer level package including a device wafer integrated with a passive component'20097,549,021'Enhanced data integrity using parallel volatile and non-volatile transfer buffers'20097,471,098'Testing device and method for an integrated circuit'20087,328,385'Method and apparatus for measuring digital timing paths by setting a scan mode of sequential storage elements'20087,198,987'Overmolded semiconductor package with an integrated EMI and RFI shield'20077,196,644'Decoupling of analog input and digital output'20077,133,228'Using data compression to achieve lower linear bit densities on a storage medium'20067,126,776'Disk drive having a sector clock that is synchronized to the angular speed of the spindle motor'20066,862,151'Method and apparatus for read error recovery'20056,654,195'Disk drive having a register set for providing real time position variables to a host'20036,435,883'High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill'20025,951,813'Top of die chip-on-board encapsulation'19995,905,639'Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds'19995,821,715'Pulsed alignment commutation state for sensorless motor start'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2003Based in Rochester, MN, US· patent location history
1999–2018Based in Newport Beach, CA, US· patent location history
1999Based in Laguna Hills, CA, US· patent location history
2005–2014Based in Loveland, CO, US· patent location history
2006–2012Patents assigned to SEAGATE TECHNOLOGY LLC (9)· patent assignee history
2007–2018Patents assigned to SKYWORKS SOLUTIONS INC (10)· patent assignee history
2011–2018Patents assigned to WARREN ROBERT W (25)· patent assignee history
2011–2016Patents assigned to CONEXANT SYSTEMS INC (9)· patent assignee history
2012–2014Patents assigned to LSI CORP (13)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
WARREN ROBERT Wself252011–2018
LSI CORP132012–2014
SKYWORKS SOLUTIONS INC102007–2018
CONEXANT SYSTEMS INC92011–2016
SEAGATE TECHNOLOGY LLC92006–2012
Locations
LocationPatentsSpan
Loveland, CO, US272005–2014
Newport Beach, California, US211999–2018
Rochester, Minnesota, US21998–2003
Laguna Hills, California, US11999