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Inventor

RINTARO UEJI

Inventor
JP

Overview

3→
Patents
2021–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering33%
B21BRolling of metal17%
C21DModifying the physical structure of ferrous metals17%
C22CAlloys17%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges17%
PatentTitleYear
11,964,338Method for low-temperature joining of metal materials, and joint structure202411,767,582Steel material exhibiting high toughness, method for manufacturing the same, and structural steel plate fabricated using steel material202311,161,199Friction bonding method2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2024Patents assigned to UNIV OSAKA (2)· patent assignee history
2021–2024Based in JP· patent location history
2023Patents assigned to NAT INST MATERIALS SCIENCE (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNIV OSAKA22021–2024
NAT INST MATERIALS SCIENCE12023
Locations
LocationPatentsSpan
JP32021–2024