Inventor
WEI-HSIU HSU
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Bprimary
H04BTransmission15%
H01LSemiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
G01RMeasuring electric variables8%
H01PWaveguides8%
H01QAntennas, i.e. radio aerials8%
H03HImpedance networks, e.g. resonant circuits8%
H04LTransmission of digital information, e.g. telegraphic communication8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G01SRadio direction-finding4%
PatentTitleYear
12,028,099Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method202411,837,552Semiconductor package with layer structures, antenna layer and electronic component202311,695,439Semiconductor chip with local oscillator buffer reused for signal transmission and associated transmission method202311,677,433Wireless system having local oscillator signal derived from reference clock output of active oscillator that has no electromechanical resonator202311,601,147Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method202311,373,957Semiconductor package with layer structures, antenna layer and electronic component2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to MEDIATEK INC (6)· patent assignee history
2022–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEDIATEK INC | 6 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2022–2024 |