Inventor
HITOSHI SHIKU
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties16%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry12%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering12%
C12MApparatus for enzymology or microbiology12%
C12NMicroorganisms or enzymes12%
C25BElectrolytic or electrophoretic processes for the production of compounds or non-metals12%
C25DProcesses for the electrolytic or electrophoretic production of coatings12%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution12%
PatentTitleYear
12,043,911Method of electrochemically producing hydrogel, method of producing hydrogel with pattern formed of cells, hydrogel production apparatus, and transducer202411,542,612Method of electrochemically producing hydrogel, method of producing hydrogel with pattern formed of cells, hydrogel production apparatus, and transducer202311,460,437Endotoxin detection device and endotoxin detection method202211,326,262Method of electrochemically producing hydrogel, method of producing hydrogel with pattern formed of cells, hydrogel production apparatus, and transducer2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to UNIV TOHOKU (4)· patent assignee history
2022–2024Patents assigned to JAPAN AVIATION ELECTRONICS IND LTD (3)· patent assignee history
2022–2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNIV TOHOKU | 4 | 2022–2024 |
| JAPAN AVIATION ELECTRONICS IND LTD | 3 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2024 |