Inventor
Yong Zhong
Inventor
Shenzhen, CN
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
G06FElectric digital data processing10%
C21DModifying the physical structure of ferrous metals8%
C22CAlloys8%
H04WWireless communication networks8%
B22DCasting of metals5%
G06NComputing arrangements based on specific computational models5%
H04LTransmission of digital information, e.g. telegraphic communication5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
B21BRolling of metal3%
PatentTitleYear
10,820,248Radio link monitoring and cell search techniques for high movement speeds202010,489,176Method, system and apparatus for creating virtual machine201910,287,659High-formability and super-strength cold-rolled steel sheet201910,100,385High-formability and super-strength hot galvanizing steel plate and manufacturing method thereof201810,094,011Superstrength cold-rolled weathering steel sheet and method of manufacturing same20189,898,700'Method, apparatus, and artificial intelligence server for determining artificial intelligence behavior'20189,875,442Method, apparatus, and artificial intelligence editor for implementing artificial intelligence behavior20189,467,390'Method and device for data transmission'20169,389,903'Method, system and apparatus for creating virtual machine'20169,285,862'Mobile terminal and power-saving method and device for same'20168,571,546'Method for implementing dual-homing'20137,448,438'Heat pipe type heat dissipation device'20087,447,027'Hybrid heat dissipation device'20087,423,873'Heat dissipation device having fan holder for attachment of a fan'20087,349,218'Locking device for a heat sink'20087,343,962'Heat sink'20087,321,491'Heat sink for a portable computer'20087,304,845'Heat sink assembly'20077,295,439'Heat sink fastening assembly'20077,174,955'Heat sink'20077,163,049'Cooling fin assembly'20077,068,513'Fixing apparatus for mounting a heat sink to a printed circuit board'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2008Patents assigned to FOXCONN TECH CO LTD (11)· patent assignee history
2006–2019Based in Shenzhen, CN· patent location history
2008Patents assigned to FU ZHUN PRECISION IND SHENZHEN (6)· patent assignee history
2008Based in Guangdong, CN· patent location history
2013–2019Patents assigned to HUAWEI TECH CO LTD (3)· patent assignee history
2013–2016Patents assigned to ZHONG YONG (3)· patent assignee history
2013Based in Guanngdong, CN· patent location history
2016–2020Based in Beijing, CN· patent location history
2018–2019Patents assigned to BAOSHAN IRON & STEEL (3)· patent assignee history
2018–2019Based in Shanghai, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FOXCONN TECH CO LTD | 11 | 2006–2008 |
| FU ZHUN PRECISION IND SHENZHEN | 6 | 2008 |
| BAOSHAN IRON & STEEL | 3 | 2018–2019 |
| HUAWEI TECH CO LTD | 3 | 2013–2019 |
| ZHONG YONGself | 3 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shenzhen, CN | 14 | 2006–2019 |
| Beijing, CN | 3 | 2016–2020 |
| Shanghai, CN | 3 | 2018–2019 |
| Guanngdong, CN | 1 | 2013 |
| Guangdong, CN | 1 | 2008 |