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Inventor

Hsien-Chie Cheng

Inventor
Hsinchu, TW

Overview

5→
Patents
2007–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
G03GElectrography14%
H01GCapacitors14%
H10BElectronic memory devices14%
PatentTitleYear
10,983,454Reflective toner level detector with relative rotating and cleaning20218,134,823'Stacked capacitor structure and manufacturing method thereof'20127,999,350'Electrode structure of memory capacitor'20117,378,746'Composite bump'20087,211,886'Three-dimensional multichip stack electronic package structure'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2012Patents assigned to IND TECH RES INST (4)· patent assignee history
2007–2012Based in Hsinchu, TW· patent location history
2008Based in Taichung, TW· patent location history
2012Patents assigned to CHEN WEN-HWA (1)· patent assignee history
2012Patents assigned to CHEN YUN-CHIAO (1)· patent assignee history
2012Patents assigned to CHENG HSIEN-CHIE (1)· patent assignee history
2021Patents assigned to AVISION INC (1)· patent assignee history
2021Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IND TECH RES INST42007–2012
AVISION INC12021
CHEN WEN-HWA12012
CHEN YUN-CHIAO12012
CHENG HSIEN-CHIEself12012
Locations
LocationPatentsSpan
Hsinchu, TW32007–2012
New Taipei, TW12021
Taichung, TW12008