Inventor
Paul G. Rickerl
Inventor
Endicott, NY, US
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form21%
H05KPrinted circuits15%
Y10TTechnical subjects covered by former us classification13%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
C08JWorking-up8%
B60JWindows, windscreens, non-fixed roofs, doors, or similar devices for vehicles5%
C03BManufacture, shaping, or supplementary processes5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B44CProducing decorative effects3%
PatentTitleYear
10,843,531Cold formed laminates202010,189,228Asymmetric processing method for reducing bow in laminate structures201910,017,033Cold formed laminates20189,931,817Methods for forming patterns in thin glass laminate structures20189,925,743'Process for laminating thin glass laminates'20186,843,929'Accelerated etching of chromium'20055,674,595'Coverlay for printed circuit boards'19975,427,848'Stress balanced composite laminate material'19955,334,487'Method for forming a patterned layer on a substrate'19945,306,741'Method of laminating polyimide to thin sheet metal'19945,156,710'Method of laminating polyimide to thin sheet metal'19924,911,786'Method of etching polyimides and resulting passivation structure'19904,883,744'Forming a polymide pattern on a substrate'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2005Patents assigned to IBM (8)· patent assignee history
1989–2020Based in Endicott, NY, US· patent location history
2018–2020Patents assigned to CORNING INC (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 1989–2005 |
| CORNING INC | 5 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 13 | 1989–2020 |