Inventor

YONGAN XU

Inventor
US

Overview

31→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 31 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices18%
H01LSemiconductor devices17%
G02BOptical elements, systems or apparatus16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G06TImage data processing or generation, in general4%
H10BElectronic memory devices4%
H10DInorganic electric semiconductor devices4%
C23CCoating metallic material2%
H04NPictorial communication, e.g. television2%
PatentTitleYear
12,584,211Method of thin film deposition in trenches202612,488,986Selective gas etching for self-aligned pattern transfer202512,374,552Methods for preparing small features on a substrate202512,327,730Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic202512,225,641Bake devices for handling and uniform baking of substrates202512,159,392Die system and method of comparing alignment vectors202412,153,344Lithography method to form structures with slanted angle202412,111,572Methods of greytone imprint lithography to fabricate optical devices202412,094,774Back-end-of-line single damascene top via spacer defined by pillar mandrels202412,085,475Method to determine line angle and rotation of multiple patterning202412,087,601Reducing line edge roughness and mitigating defects by wafer freezing202412,060,297Methods and apparatus of processing transparent substrates202412,021,102Imaging system and method of creating composite images202411,977,246Mask orientation202411,978,639Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic202411,815,823Alignment mark for front to back side alignment and lithography for optical device fabrication202311,784,120Metal via structure202311,754,919Lithography method to form structures with slanted angle202311,709,423Methods of greytone imprint lithography to fabricate optical devices202311,699,591Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic202311,669,012Maskless lithography method to fabricate topographic substrate202311,630,251Mask orientation202311,610,925Imaging system and method of creating composite images202311,572,619Method of thin film deposition in trenches202311,543,793Developer critical dimension control with pulse development202311,501,969Direct extreme ultraviolet lithography on hard mask with reverse tone202211,398,409Method of forming a BEOL interconnect structure using a subtractive metal via first process202211,302,533Selective gas etching for self-aligned pattern transfer202211,237,485System, software application, and method for lithography stitching202211,226,440Mask orientation202211,152,298Metal via structure2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2024Patents assigned to IBM (7)· patent assignee history
2021–2026Based in US· patent location history
2022–2026Patents assigned to APPLIED MATERIALS INC (19)· patent assignee history
2022Patents assigned to TESSERA INC (1)· patent assignee history
2023–2024Patents assigned to TESSERA LLC (2)· patent assignee history
2025Patents assigned to ADEIA SEMICONDUCTOR SOLUTIONS LLC (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC192022–2026
IBM72021–2024
ADEIA SEMICONDUCTOR SOLUTIONS LLC22025
TESSERA LLC22023–2024
TESSERA INC12022
Locations
LocationPatentsSpan
US312021–2026