Inventor
Akihisa Kuroyanagi
Inventor
Suwon-si, KR
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1057%
H01LSemiconductor devices36%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
10,854,528Semiconductor package including organic interposer202010,692,791Electronic component package with electromagnetic wave shielding202010,541,187Semiconductor package including organic interposer202010,504,836Fan-out semiconductor package201910,475,776Fan-out semiconductor package module20196,933,618'Tablet comprising epoxy resin composition'20056,852,263'Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition'20056,646,063'Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2005Patents assigned to NITTO DENKO CORP (3)· patent assignee history
2003–2005Based in Ibaraki, JP· patent location history
2019–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (5)· patent assignee history
2019–2020Based in Suwon-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 5 | 2019–2020 |
| NITTO DENKO CORP | 3 | 2003–2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 5 | 2019–2020 |
| Ibaraki, JP | 3 | 2003–2005 |