Inventor
WEIMIN HAN
Inventor
US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H05BElectric heating14%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
PatentTitleYear
12,550,698Via profile shrink for advanced integrated circuit structure fabrication202611,482,433Stacked thermal processing chamber modules for remote radiative heating in semiconductor device manufacture202211,276,760Non-planar semiconductor device having omega-fin with doped sub-fin region and method to fabricate same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (3)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 3 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 3 | 2022–2026 |