LexDanaLexDanabeta
Inventor

Toshiyuki Asahi

Inventor
Osaka, JP

Overview

45→
Patents
1998–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 45 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
Y10TTechnical subjects covered by former us classification15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
H10NElectric solid-state devices not otherwise provided for4%
H05BElectric heating3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
G02BOptical elements, systems or apparatus2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
10,607,763Reactor20209,730,320'Prepreg, laminate, metal foil-clad laminate, circuit board and LED module'20178,866,022'Printed wiring board, build-up multi-layer board, and production method therefor'20148,603,624'Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting'20138,465,666'Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition'20138,064,213'Module with a built-in component, and electronic device with the same'20117,968,800'Passive component incorporating interposer'20117,888,789'Transfer material used for producing a wiring substrate'20117,821,795'Multilayer wiring board'20107,748,110'Method for producing connection member'20107,667,977'Mounting board, mounted body, and electronic equipment using the same'20107,418,603'Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program'20087,394,663'Electronic component built-in module and method of manufacturing the same'20087,390,692'Semiconductor device and method for manufacturing the same'20087,341,890'Circuit board with built-in electronic component and method for manufacturing the same'20087,294,587'Component built-in module and method for producing the same'20077,258,549'Connection member and mount assembly and production method of the same'20077,248,482'Module with built-in circuit component and method for producing the same'20077,242,823'Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus'20077,198,996'Component built-in module and method for producing the same'20077,180,169'Circuit component built-in module and method for manufacturing the same'20077,136,543'Mount assembly, optical transmission line and photoelectric circuit board'20067,132,756'Semiconductor device and method for manufacturing the same'20067,091,593'Circuit board with built-in electronic component and method for manufacturing the same'20067,061,100'Semiconductor built-in millimeter-wave band module'20067,018,866'Circuit component built-in module with embedded semiconductor chip and method of manufacturing'20066,975,516'Component built-in module and method for producing the same'20056,955,948'Method of manufacturing a component built-in module'20056,939,738'Component built-in module and method for producing the same'20056,936,774'Wiring substrate produced by transfer material method'20056,931,725'Circuit component built-in module, radio device having the same, and method for producing the same'20056,885,788'Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module'20056,871,396'Transfer material for wiring substrate'20056,855,892'Insulation sheet, multi-layer wiring substrate and production processes thereof'20056,794,796'Piezoelectric transformer, piezoelectric transformer drive circuit, piezoelectric transformer drive method and cold cathode tube drive apparatus using piezoelectric transformer'20046,784,530'Circuit component built-in module with embedded semiconductor chip and method of manufacturing'20046,737,816'Piezoelectric transformer, piezoelectric transformer drive circuit, piezoelectric transformer drive method and cold cathode tube drive apparatus using piezoelectric transformer'20046,734,542'Component built-in module and method for producing the same'20046,583,534'Piezoelectric transformer, piezoelectric transformer drive circuit, piezoelectric transformer drive method and cold cathode tube drive apparatus using piezoelectric transformer'20036,538,210'Circuit component built-in module, radio device having the same, and method for producing the same'20036,489,685'Component built-in module and method of manufacturing the same'20026,433,458'Method and unit for driving piezoelectric transformer used for controlling luminance of cold-cathode tube'20026,392,525'Magnetic element and method of manufacturing the same'20026,118,209'Piezoelectric ceramic composition and piezoelectric transformer'20005,793,948'Method and apparatus for recording and analyzing an interaction log'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998Based in Tokyo, JP· patent location history
2000–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (32)· patent assignee history
2000–2020Based in Osaka, JP· patent location history
2002Based in Hyogo, JP· patent location history
2007–2011Based in Hirakata, JP· patent location history
2010–2014Patents assigned to PANASONIC CORP (9)· patent assignee history
2011–2017Patents assigned to ASAHI TOSHIYUKI (5)· patent assignee history
2013–2017Patents assigned to KITAGAWA YOSHITO (3)· patent assignee history
2013–2017Patents assigned to TANI NAOYUKI (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD322000–2008
PANASONIC CORP92010–2014
ASAHI TOSHIYUKIself52011–2017
KITAGAWA YOSHITO32013–2017
TANI NAOYUKI32013–2017
Locations
LocationPatentsSpan
Osaka, JP402000–2020
Hirakata, JP32007–2011
Hyogo, JP12002
Tokyo, JP11998