Inventor
SANDEEP B. SANE
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H05KPrinted circuits24%
G06FElectric digital data processing6%
PatentTitleYear
12,347,783Interconnect architecture with silicon interposer and EMIB202511,983,135Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge202411,901,299Interconnect architecture with silicon interposer and EMIB202411,824,013Package substrate with reduced interconnect stress202311,557,541Interconnect architecture with silicon interposer and EMIB202311,417,592Methods of utilizing low temperature solder assisted mounting techniques for package structures202211,276,625Methods of forming flexure based cooling solutions for package structures2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (7)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2025 |