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Inventor

Chee-Way Oh

Inventor
Hsinchu, TW

Overview

2→
Patents
2011–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
8,258,606'High frequency flip chip package structure of polymer substrate'20128,033,039'High frequency flip chip package process of polymer substrate and structure thereof'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011Patents assigned to UNIV NAT CHIAO TUNG (1)· patent assignee history
2011–2012Based in Hsinchu, TW· patent location history
2012Patents assigned to CHANG EDWARD-YI (1)· patent assignee history
2012Patents assigned to HSU LI-HAN (1)· patent assignee history
2012Patents assigned to OH CHEE-WAY (1)· patent assignee history
2012Patents assigned to WANG CHIN-TE (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANG EDWARD-YI12012
HSU LI-HAN12012
OH CHEE-WAYself12012
UNIV NAT CHIAO TUNG12011
WANG CHIN-TE12012
Locations
LocationPatentsSpan
Hsinchu, TW22011–2012