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Inventor

Tean Wee Ong

Inventor
Penang, MY

Overview

4→
Patents
2012–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G11Cprimary
G11CStatic stores22%
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
G06FElectric digital data processing11%
H10BElectronic memory devices11%
H10DInorganic electric semiconductor devices11%
PatentTitleYear
11,004,975Semiconductor device and manufacturing method thereof202110,916,305RRAM-based monotonic counter20219,397,016'Flip chip assembly process for ultra thin substrate and package on package assembly'20168,258,019'Flip chip assembly process for ultra thin substrate and package on package assembly'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2016Patents assigned to INTEL CORP (2)· patent assignee history
2012Patents assigned to LIM BOK SIM (1)· patent assignee history
2012Patents assigned to LIM SIH FEI (1)· patent assignee history
2012Patents assigned to LOKE MUN LEONG (1)· patent assignee history
2012–2016Based in Penang, MY· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Taipei, TW· patent location history
2021Based in Jhubei City, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP22012–2016
TAIWAN SEMICONDUCTOR MFG CO LTD22021
LIM BOK SIM12012
LIM SIH FEI12012
LOKE MUN LEONG12012
Locations
LocationPatentsSpan
Penang, MY22012–2016
Taipei, TW12021
Jhubei City, TW12021