Inventor

Chin-Wei Kuo

Inventor
Zhubei City, TW

Overview

52→
Patents
2011–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 52 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices23%
H10DInorganic electric semiconductor devices19%
H01FMagnets9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
G01RMeasuring electric variables3%
Y10TTechnical subjects covered by former us classification3%
G06FElectric digital data processing2%
H01PWaveguides2%
H01QAntennas, i.e. radio aerials2%
PatentTitleYear
10,840,201Methods and apparatus for transmission lines in packages202010,714,441Filter and capacitor using redistribution layer and micro bump layer202010,665,380Compact vertical inductors extending in vertical planes202010,665,539Semiconductor device with patterned ground shielding202010,629,756Semiconductor structure202010,276,295Compact vertical inductors extending in vertical planes201910,269,746Methods and apparatus for transmission lines in packages20199,960,133Filter and capacitor using redistribution layer and micro bump layer20189,923,101'Semiconductor structure'20189,831,173Slot-shielded coplanar strip-line compatible with CMOS processes20179,658,275'De-embedding on-wafer devices'20179,653,531'Methods of manufacturing a package'20179,633,149'System and method for modeling through silicon via'20179,633,940'Structure and method for a high-K transformer with capacitive coupling'20179,607,942'Semiconductor device with patterned ground shielding'20179,559,053'Compact vertical inductors extending in vertical planes'20179,530,705'4 port L-2L de-embedding method'20169,472,612'Integrated capacitor'20169,449,917'Method of forming an inductor with magnetic material'20169,449,945'Filter and capacitor using redistribution layer and micro bump layer'20169,385,246'Differential MOSCAP device'20169,373,673'3-D inductor and transformer'20169,331,013'Integrated capacitor'20169,203,146'Antenna using through-silicon via'20159,171,798'Methods and apparatus for transmission lines in packages'20159,147,020'Transmission line characterization using EM calibration'20159,121,891'Apparatus and methods for de-embedding through substrate vias'20159,103,884'De-embedding on-wafer devices'20159,087,840'Slot-shielded coplanar strip-line compatible with CMOS processes'20159,087,838'Structure and method for a high-K transformer with capacitive coupling'20159,059,026'3-D inductor and transformer'20159,041,152'Inductor with magnetic material'20158,975,979'Transformer with bypass capacitor'20158,946,832'Filter using a waveguide structure'20158,941,212'Helical spiral inductor between stacking die'20158,912,581'3D transmission lines for semiconductors'20148,901,714'Transmission line formed adjacent seal ring'20148,901,752'Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps'20148,896,094'Methods and apparatus for inductors and transformers in packages'20148,860,114'Structure and method for a fishbone differential capacitor'20148,809,073'Apparatus and methods for de-embedding through substrate vias'20148,754,818'Integrated antenna structure on separate semiconductor die'20148,674,883'Antenna using through-silicon via'20148,609,479'Gated-varactors'20138,552,812'Transformer with bypass capacitor'20138,502,338'Through-substrate via waveguides'20138,471,358'3D inductor and transformer'20138,399,961'Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps'20138,362,591'Integrated circuits and methods of forming the same'20138,273,616'Gated-varactors'20128,115,280'Four-terminal gate-controlled LVBJTs'20127,931,379'Projection system, projection lens module, optical actuator and its driving method'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011Based in Taoyuan County, TW· patent location history
2012–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (29)· patent assignee history
2012–2017Patents assigned to KUO CHIN-WEI (19)· patent assignee history
2012–2020Based in Zhubei City, TW· patent location history
2012–2017Based in Hsinchu, TW· patent location history
2013–2017Patents assigned to YEN HSIAO-TSUNG (15)· patent assignee history
2013–2017Patents assigned to LIN YU-LING (12)· patent assignee history
2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (22)· patent assignee history
2017–2018Based in Hsinchu County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG292012–2016
TAIWAN SEMICONDUCTOR MFG CO LTD222015–2020
KUO CHIN-WEIself192012–2017
YEN HSIAO-TSUNG152013–2017
LIN YU-LING122013–2017
Locations
LocationPatentsSpan
Zhubei City, TW452012–2020
Hsinchu, TW42012–2017
Hsinchu County, TW22017–2018
Taoyuan County, TW12011