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Inventor

Nobuya Koike

Inventor
Tokyo, JP

Overview

31→
Patents
1997–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 31 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1049%
H10DInorganic electric semiconductor devices19%
H01LSemiconductor devices16%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems6%
H05KPrinted circuits3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
G01RMeasuring electric variables2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
PatentTitleYear
10,453,946Semiconductor device and an electronic device201910,031,164Semiconductor device20189,997,620Semiconductor device and an electronic device20189,704,979'Semiconductor device and an electronic device'20179,396,971'Semiconductor device and a manufacturing method thereof'20169,230,831'Semiconductor device and a manufacturing method thereof'20169,129,979'Semiconductor device'20159,024,423'Semiconductor device for a DC-DC converter'20158,994,159'Semiconductor device and manufacturing method thereof'20158,975,733'Semiconductor device and a manufacturing method thereof'20158,564,112'Semiconductor device'20138,367,479'Semiconductor device and manufacturing method thereof'20138,362,626'Semiconductor device with non-overlapped circuits'20138,338,927'Semiconductor device with the leads projected from sealing body'20128,298,859'Semiconductor connection component'20128,299,599'Semiconductor device'20128,232,629'Semiconductor device'20128,114,710'Manufacturing method of resin-sealed semiconductor device'20128,026,130'Method for manufacturing a semiconductor integrated circuit device'20117,968,370'Semiconductor connection component'20117,462,887'Semiconductor connection component'20087,141,741'Circuit board'20066,849,933'Semiconductor mounting device and method of manufacturing the same'20056,492,739'Semiconductor device having bumper portions integral with a heat sink'20026,434,008'Semiconductor device'20026,392,308'Semiconductor device having bumper portions integral with a heat sink'20026,320,270'Semiconductor device and method of producing the same'20016,104,085'Semiconductor device and method of producing the same'20005,956,231'Semiconductor device having power semiconductor elements'19995,808,359'Semiconductor device having a heat sink with bumpers for protecting outer leads'19985,621,243'Semiconductor device having thermal stress resistance structure'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2002Patents assigned to HITACHI LTD (8)· patent assignee history
1997–2005Based in Maebashi, JP· patent location history
1998–2006Based in Takasaki, JP· patent location history
2008–2018Based in Tokyo, JP· patent location history
2011–2019Patents assigned to RENESAS ELECTRONICS CORP (20)· patent assignee history
2012–2015Patents assigned to KOIKE NOBUYA (10)· patent assignee history
2012–2015Patents assigned to NAKAMURA HIROYUKI (6)· patent assignee history
2012–2015Patents assigned to FUJIKI ATSUSHI (5)· patent assignee history
2012–2019Based in Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RENESAS ELECTRONICS CORP202011–2019
KOIKE NOBUYAself102012–2015
HITACHI LTD81997–2002
NAKAMURA HIROYUKI62012–2015
FUJIKI ATSUSHI52012–2015
Locations
LocationPatentsSpan
Tokyo, JP112008–2018
Kanagawa, JP102012–2019
Takasaki, JP81998–2006
Maebashi, JP21997–2005