Inventor

Hongfei Jia

Inventor

Ann Arbor, MI, US

Overview

2016–2021

Patent span

Chemistry

Primary field (CPC C)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C01Pprimary

C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds11%

H02HEmergency protective circuit arrangements11%

C01GCompounds containing metals not covered by subclasses c01d or c01f6%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%

C08LCompositions of macromolecular compounds6%

C09CTreatment of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties6%

C09DCoating compositions, e.g. paints, varnishes or lacquers6%

C11DDetergent compositions6%

C25BElectrolytic or electrophoretic processes for the production of compounds or non-metals6%

G05BControl or regulating systems in general6%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2016Based in Beijing, CN· patent location history

2018Patents assigned to STATE GRID CORP CHINA (2)· patent assignee history

2018Patents assigned to XJ ELECTRIC CO LTD (2)· patent assignee history

2018Patents assigned to XJ GROUP CORP (2)· patent assignee history

2018Patents assigned to XUCHANG XJ SOFTWARE TECH LTD (2)· patent assignee history

2018Based in Xuchang, CN· patent location history

2021Patents assigned to TOYOTA ENG & MFG NORTH AMERICA (3)· patent assignee history

2021Based in Ann Arbor, MI, US· patent location history

Assignee and location history derived from the patent record.

Assignees

Locations