Inventor

James J. Casto

Inventor

Austin, TX, US

Overview

15→

Patents

1990–2004

Patent span

Electricity

Primary field (CPC H)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%

Y10TTechnical subjects covered by former us classification13%

H05KPrinted circuits10%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%

G06FElectric digital data processing7%

Y02PClimate change mitigation technologies in the production or processing of goods7%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use3%

PatentTitleYear

6,791,157'Integrated circuit package incorporating programmable elements'2004 6,772,356'System for specifying core voltage for a microprocessor by selectively outputting one of a first, fixed and a second, variable voltage control settings from the microprocessor'2004 6,732,266'Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements'2004 6,449,170'Integrated circuit package incorporating camouflaged programmable elements'2002 5,498,767'Method for positioning bond pads in a semiconductor die layout'1996 5,455,200'Method for making a lead-on-chip semiconductor device having peripheral bond pads'1995 5,381,036'Lead-on chip semiconductor device having peripheral bond pads'1995 5,172,214'Leadless semiconductor device and method for making the same'1992 5,147,821'Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation'1992 5,147,815'Method for fabricating a multichip semiconductor device having two interdigitated leadframes'1992 5,105,259'Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation'1992 5,060,052'TAB bonded semiconductor device having off-chip power and ground distribution'1991 5,045,914'Plastic pad array electronic AC device'1991 5,014,113'Multiple layer lead frame'1991 4,924,291'Flagless semiconductor package'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–1996Patents assigned to MOTOROLA INC (11)· patent assignee history

1990–2004Based in Austin, TX, US· patent location history

2002–2004Patents assigned to ADVANCED MICRO DEVICES INC (4)· patent assignee history

2004Based in Lakeway, TX, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MOTOROLA INC	11	1990–1996
ADVANCED MICRO DEVICES INC	4	2002–2004

Locations

Location	Patents	Span
Austin, Texas, US	14	1990–2004
Lakeway, Texas, US	1	2004