Inventor
Yoshiaki Esaki
Inventor
Osaka, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits27%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form20%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds20%
C08LCompositions of macromolecular compounds20%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
10,751,976Resin-clad metal foil and flexible printed wiring board202010,543,661Metal foil with resin, and metal-clad laminate and circuit board using same20209,232,636'Flexible printed wiring board and laminate for production of flexible printed wiring board'20169,125,307'Flexible metal-cladded base material, method for producing flexible metal-cladded base material, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring board'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2020Patents assigned to PANASONIC IP MAN CO LTD (4)· patent assignee history
2015–2020Based in Osaka, JP· patent location history
2016Patents assigned to ESAKI YOSHIAKI (1)· patent assignee history
2016Patents assigned to FUKUSUMI HIROYUKI (1)· patent assignee history
2016Patents assigned to ISHIKAWA YOHSUKE (1)· patent assignee history
2016Patents assigned to OZEKI TAKAYOSHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC IP MAN CO LTD | 4 | 2015–2020 |
| ESAKI YOSHIAKIself | 1 | 2016 |
| FUKUSUMI HIROYUKI | 1 | 2016 |
| ISHIKAWA YOHSUKE | 1 | 2016 |
| OZEKI TAKAYOSHI | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 4 | 2015–2020 |