Inventor
Hyun Joon Oh
Inventor
Seongnam-si, KR
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing14%
H10KOrganic electric solid-state devices11%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein8%
H01LSemiconductor devices8%
G02BOptical elements, systems or apparatus7%
G09FDisplaying7%
Y10TTechnical subjects covered by former us classification5%
C09JAdhesives4%
H05BElectric heating4%
PatentTitleYear
10,877,302Cover window of a flexible display device and method of manufacturing a cover window of a flexible display device202010,667,417Cover window for display device and display device including the same202010,632,711Window for flexible display device and flexible display device having the same202010,481,053Method for detecting defects of glass substrates201910,444,798Flexible window substrate and flexible display device having the same201910,401,906Cover window for display device and display device including the same201910,331,176Electronic device with a foldable display and method of operating the same201910,331,172Flexible window substrate and flexible display device having the same201910,168,740Flexible window substrate and flexible display device having the same201910,026,924Organic light emitting display apparatus and manufacturing method thereof20189,733,674'Display device'20179,619,059'Stretchable display device'20179,525,153'Organic light emitting display apparatus and manufacturing method thereof'20169,519,083'Display window for display apparatus and display apparatus including the same'20169,196,867'Organic light emitting display apparatus and manufacturing method thereof'20158,946,759'Organic light emitting display device with improved sealing property'20157,958,628'Bonding tool for mounting semiconductor chips'20117,650,688'Bonding tool for mounting semiconductor chips'20107,306,971'Semiconductor chip packaging method with individually placed film adhesive pieces'20076,726,818'Biosensors with porous chromatographic membranes'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004Patents assigned to I SENS INC (1)· patent assignee history
2004Based in Seoul, KR· patent location history
2007–2010Patents assigned to CHIPPAC INC (2)· patent assignee history
2007–2011Based in Austin, TX, US· patent location history
2015–2020Patents assigned to SAMSUNG DISPLAY CO LTD (16)· patent assignee history
2015Patents assigned to MOON JUNG WOO (1)· patent assignee history
2015Patents assigned to OH HYUN JOON (1)· patent assignee history
2015–2020Based in Seongnam-si, KR· patent location history
2015–2016Based in Yongin, KR· patent location history
2018Based in Yongin-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG DISPLAY CO LTD | 16 | 2015–2020 |
| CHIPPAC INC | 2 | 2007–2010 |
| I SENS INC | 1 | 2004 |
| MOON JUNG WOO | 1 | 2015 |
| OH HYUN JOONself | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seongnam-si, KR | 12 | 2015–2020 |
| Yongin, KR | 3 | 2015–2016 |
| Austin, Texas, US | 3 | 2007–2011 |
| Yongin-si, KR | 1 | 2018 |
| Seoul, KR | 1 | 2004 |