Inventor
RONALD S. COK
Inventor
US
Overview
Patents· 111 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10HInorganic light-emitting semiconductor devices having potential barriers9%
G09GArrangements or circuits for control of indicating devices using static means to present variable information8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H03HImpedance networks, e.g. resonant circuits5%
H05KPrinted circuits4%
H10NElectric solid-state devices not otherwise provided for3%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
PatentTitleYear
12,588,471Micro-device substrate structures with posts and indentations202612,531,537Suspended components and functional frames202612,528,308Hybrid documents with electronic indicia202612,518,676Memory architectures for hybrid cluster displays202612,494,367Printing components to substrate posts with gaps202512,490,565Multi-LED structures with single current and voltage supplies202512,482,799Modules with integrated circuits and devices202512,456,706Variable stiffness modules202512,437,174Hybrid documents with electronic indicia202512,438,015Stamps with structured microposts202512,420,543Transfer printing stamps and methods of stamp delamination202512,414,471Piezoelectric power components202512,396,101Flexible electronic structures202512,394,657Transfer printing stamps and methods of stamp delamination202512,394,361Multiplexed column drivers for passive-matrix control202512,387,658Display dimming for pulse-width-modulation pixel control202512,389,544Method of making a stacked electronic component202512,300,150Color-agnostic pixel repair sites2025RE050432Antenna with micro-transfer-printed circuit element202512,288,511Dynamic-voltage control for displays202512,260,798Displays with distributed pixel interpolation202512,261,248Displays with interpolated pixels202512,240,262Rigid micro-modules with iLED and light conductor202512,237,443Printed components in device pockets202512,237,310Disaggregated transistor devices202512,236,825Redundant pixel layouts202512,218,415Antenna encapsulation202512,198,616Pixel group and column token display architectures202512,190,790Displays with current-controlled pixel clusters202512,170,349Printed structure with electrical contact having reflowable polymer core202412,162,747Enclosed cavity structures202412,112,678Hybrid pulse-width-modulation pixels202412,100,792White-light-emitting LED structures202412,094,851Particle capture using transfer stamp202412,074,583Printing components to adhesive substrate posts202412,068,739Micro-transfer-printed acoustic wave filter device202412,057,541White-light-emitting LED structures202412,051,762Hybrid electro-optically controlled matrix-addressed systems202412,043,541Overhanging device structures and related methods of manufacture202412,039,917Displays with hybrid-control pixel clusters202412,016,131Transfer printing high-precision devices202411,990,438Chiplets with connection posts202411,981,559Enclosed cavity structures202411,950,375Printing components to substrate posts202411,935,464Multi-row buffering for active-matrix cluster displays202411,916,179Structures and methods for electrically connecting printed horizontal components202411,914,815Displays with integrated touch screens202411,916,174Displays with interpolated pixels202411,897,760Enclosed cavity structures202411,890,890Rigid micro-modules with iLED and light conductor202411,884,537Enclosed cavity structures202411,881,475Modules with integrated circuits and devices202411,863,154Non-linear tethers for suspended devices202411,854,855Micro-transfer printing with selective component removal202311,834,330Enclosed cavity structures202311,817,040Pixel group and column token display architectures202311,817,434Displays with embedded light emitters202311,804,431Laser-formed interconnects for redundant devices202311,799,061Displays with unpatterned layers of light-absorbing material202311,777,065White-light-emitting LED structures202311,742,450Hybrid electro-optically controlled matrix-addressed systems202311,721,051Imaging product selection system202311,705,457Monolithic multi-FETS202311,705,439LED color displays with multi-LED sub-pixels202311,670,603Micro-component anti-stiction structures202311,670,602Secure integrated-circuit systems202311,652,082Particle capture using transfer stamp202311,637,540Non-linear tethers for suspended devices202311,626,856Non-linear tethers for suspended devices202311,600,744Device source wafers with patterned dissociation interfaces202311,592,933Displays with integrated touch screens202311,588,075Displays with interpolated pixels202311,568,803Multi-row buffering for active-matrix cluster displays202311,568,796Displays with current-controlled pixel clusters202311,552,034Chiplets with connection posts202311,538,849Multi-LED structures with reduced circuitry202211,527,691Structures and methods for electrically connecting printed components202211,528,808Printing components to substrate posts202211,495,172Pixel group and column token display architectures202211,495,560Chiplets with connection posts202211,488,518Pixel group and column token display architectures202211,490,519Printed stacked micro-devices202211,488,943Modules with integrated circuits and devices202211,489,037Tiled displays with black-matrix support screens202211,482,979Printing components over substrate post edges202211,430,774Bezel-free displays202211,430,375Pulse-density-modulation pixel control circuits and devices including them202211,398,399Components with backside adhesive layers202211,393,730Pressure-activated electrical interconnection with additive repair202211,387,178Printable 3D electronic components and structures202211,386,826Flat-panel pixel arrays with signal regeneration202211,387,153Pressure-activated electrical interconnection with additive repair202211,374,086Devices with a single metal layer202211,318,663Multi-layer stamp202211,322,460Secure integrated-circuit systems202211,315,909Displays with embedded light emitters202211,316,086Printed structures with electrical contact having reflowable polymer core202211,309,197Micro-transfer printing with selective component removal202211,289,652OLEDs for micro transfer printing202211,282,439Analog pulse-width-modulation control circuits202211,282,786Laser-formed interconnects for redundant devices202211,276,657Chiplets with connection posts202211,274,035Overhanging device structures and related methods of manufacture202211,265,992Electrically parallel fused LEDs202211,251,139Secure integrated-circuit systems202211,230,471Micro-transfer-printed compound sensor device202211,233,170Device source wafers with patterned dissociation interfaces202211,164,934Tiled displays with black-matrix support screens202111,152,395Monolithic multi-FETs202111,137,641LED structure with polarized light emission202111,139,797Micro-transfer-printed acoustic wave filter device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to X DISPLAY COMPANY TECH LTD (74)· patent assignee history
2021–2026Patents assigned to X CELEPRINT LTD (36)· patent assignee history
2021–2026Based in US· patent location history
2023–2024Patents assigned to DISPLAY COMPANY TECH LIMITED (2)· patent assignee history
2023Patents assigned to KODAK ALARIS INC (1)· patent assignee history
2025Patents assigned to LEONHARD KURZ STIFTUNG & CO KG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| X DISPLAY COMPANY TECH LTD | 74 | 2021–2026 |
| X CELEPRINT LTD | 36 | 2021–2026 |
| DISPLAY COMPANY TECH LIMITED | 2 | 2023–2024 |
| KODAK ALARIS INC | 1 | 2023 |
| LEONHARD KURZ STIFTUNG & CO KG | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 111 | 2021–2026 |