Inventor
Yao-Hsin Feng
Inventor
Hualien County, TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
G01RMeasuring electric variables23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H05KPrinted circuits8%
PatentTitleYear
7,229,846'Semiconductor package having an optical device and a method of making the same'20077,122,459'Semiconductor wafer package and manufacturing method thereof'20067,115,484'Method of dicing a wafer'20066,768,332'Semiconductor wafer and testing method for the same'20046,483,187'Heat-spread substrate'20026,429,049'Laser method for forming vias'20026,392,424'Press plate of wire bond checking system'20026,172,318'Base for wire bond checking'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2007Patents assigned to ADVANCED SEMICONDUCTOR ENG (8)· patent assignee history
2001Based in Hua Lien, TW· patent location history
2002–2006Based in Hualien County, TW· patent location history
2007Based in Kaoshiung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 8 | 2001–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hualien County, TW | 6 | 2002–2006 |
| Kaoshiung, TW | 1 | 2007 |
| Hua Lien, TW | 1 | 2001 |