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Inventor

Hao-Jen Huang

Inventor
New Taipei, TW

Overview

5→
Patents
2015–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics27%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering27%
B29LIndexing scheme associated with subclass b29c, relating to particular articles13%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts7%
B82YSpecific uses or applications of nanostructures7%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
H05BElectric heating7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
10,654,260Stereolithography apparatus202010,406,746Heating head for three-dimensional printing pen201910,173,411Three-dimensional printing apparatus20199,346,217'Three-dimensional printing apparatus'20168,947,516'High-resolution 3D imaging of single semiconductor nanocrystals'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015Patents assigned to BAWENDI MOUNGI G (1)· patent assignee history
2015Based in New York, NY, US· patent location history
2016–2020Patents assigned to KINPO ELECT INC (4)· patent assignee history
2016–2020Patents assigned to XYZPRINTING INC (4)· patent assignee history
2016Patents assigned to CAL COMP ELECTRONICS & COMM CO (1)· patent assignee history
2016–2020Based in New Taipei, TW· patent location history
2019Patents assigned to CAL COMP ELECTRONICS & COMMUNICATIONS COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KINPO ELECT INC42016–2020
XYZPRINTING INC42016–2020
BAWENDI MOUNGI G12015
CAL COMP ELECTRONICS & COMM CO12016
CAL COMP ELECTRONICS & COMMUNICATIONS COMPANY LTD12019
Locations
LocationPatentsSpan
New Taipei, TW42016–2020
New York, New York, US12015