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Inventor

Takushi Maeda

Inventor
Hiroshima, JP

Overview

3→
Patents
1992–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Pprimary
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure14%
H01LSemiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
11,004,761Packaging of a semiconductor device with dual sealing materials20215,483,106'Semiconductor device for sensing strain on a substrate'19965,150,616'Semiconductor strain sensor and manufacturing method thereof'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–1996Patents assigned to NIPPON DENSO CO (2)· patent assignee history
1992Based in Aichi, JP· patent location history
1996Based in Obu, JP· patent location history
2021Patents assigned to MITSUBISHI ELECTRIC CORP (1)· patent assignee history
2021Based in Hiroshima, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NIPPON DENSO CO21992–1996
MITSUBISHI ELECTRIC CORP12021
Locations
LocationPatentsSpan
Hiroshima, JP12021
Obu, JP11996
Aichi, JP11992