Inventor
Souichi Katagiri
Inventor
Kodaira, JP
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Jprimary
H01JElectric discharge tubes or discharge lamps24%
B24BMachines, devices, or processes for grinding or polishing20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
B82YSpecific uses or applications of nanostructures6%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool4%
B24DTools for grinding, buffing or sharpening4%
C25FProcesses for the electrolytic removal of materials from objects4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
C23FNon-mechanical removal of metallic material from surface2%
PatentTitleYear
10,903,037Charged particle beam device202110,804,084Vacuum apparatus20209,837,243Ion pump and charged particle beam device using the same20179,006,654'Charged particle beam apparatus'20158,866,371'Electric field discharge-type electron source'20148,772,735'Charged particle beam apparatus, and method of controlling the same'20148,686,380'Charged particle beam apparatus'20148,426,835'Charged particle radiation device'20138,319,193'Charged particle beam apparatus, and method of controlling the same'20128,268,209'Pattern forming method and its mold'20127,781,743'Charged particle beam system and method for evacuation of the system'20107,759,652'Electron lens and charged particle beam apparatus'20107,745,237'Pattern forming method and pattern forming system'20107,615,765'Charged particle beam apparatus'20097,582,885'Charged particle beam apparatus'20097,144,298'Method for manufacturing semiconductor device and apparatus for manufacturing thereof'20066,908,860'Method for manufacturing semiconductor device and apparatus for manufacturing thereof'20056,777,337'Planarizing method of semiconductor wafer and apparatus thereof'20046,734,103'Method of polishing a semiconductor device'20046,723,144'Semiconductor device fabricating method'20046,663,468'Method for polishing surface of semiconductor device substrate'20036,612,912'Method for fabricating semiconductor device and processing apparatus for processing semiconductor device'20036,589,871'Processing method, measuring method and producing method of semiconductor devices'20036,565,424'Method and apparatus for planarizing semiconductor device'20036,524,961'Semiconductor device fabricating method'20036,477,825'Flattening and machining method and apparatus'20026,390,895'Flattening and machining method and apparatus'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2017Patents assigned to HITACHI LTD (14)· patent assignee history
2002–2014Based in Kodaira, JP· patent location history
2009–2021Patents assigned to HITACHI HIGH TECH CORP (12)· patent assignee history
2012–2014Patents assigned to KATAGIRI SOUICHI (5)· patent assignee history
2012–2014Patents assigned to OHSHIMA TAKASHI (4)· patent assignee history
2012–2014Patents assigned to KASUYA KEIGO (3)· patent assignee history
2014–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 14 | 2002–2017 |
| HITACHI HIGH TECH CORP | 12 | 2009–2021 |
| KATAGIRI SOUICHIself | 5 | 2012–2014 |
| OHSHIMA TAKASHI | 4 | 2012–2014 |
| KASUYA KEIGO | 3 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kodaira, JP | 22 | 2002–2014 |
| Tokyo, JP | 5 | 2014–2021 |