LexDanaLexDanabeta
Inventor

Hsin-Chiang Lin

Inventor
Hsinchu, TW

Overview

30→
Patents
2003–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 30 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01LSemiconductor devices12%
G09GArrangements or circuits for control of indicating devices using static means to present variable information6%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
B01FMixing, e.g. dissolving, emulsifying or dispersing3%
B01LChemical or physical laboratory apparatus for general use3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
H10DInorganic electric semiconductor devices3%
F16KValves1%
PatentTitleYear
10,937,386Color calibrator202110,939,095Display system for calibrating a displayed image by using a calibration device202110,930,194Display method and display system for reducing image delay by adjusting an image data clock signal202110,930,248Display method and display system for reducing a double image effect202110,705,376Liquid crystal display device202010,222,024Lens for light emitting device201910,133,133Liquid crystal display base20189,786,642'Light emitting diode package substrate and light emitting diode package element'20179,123,870'LED package structure'20158,981,419'LED'20158,945,959'LED with thin package struture and method for manufacturing the same'20158,896,009'Light emitting diode with two alternative mounting sides for mounting on circuit board'20148,883,533'Method for manufacturing light emitting diode package'20148,846,422'Method for manufacturing LED package struture and method for manufacturing LEDs using the LED packange struture'20148,835,198'Method for manufacturing LED'20148,816,385'Light emitting diode package and method for manufacturing the same'20148,748,200'Method for manufacturing LED package'20148,735,933'Light emitting diode package and method of manufacturing the same'20148,664,018'Manufacturing method for LED package'20148,633,507'LED with versatile mounting ways'20148,569,080'Method for packaging light emitting diode'20138,569,791'LED and method for manufacturing the same'20138,535,960'Method for packaging light emitting diode having fluorescent material directly coated on LED die thereof'20138,513,695'LED package and method for making the same'20138,492,180'LED and method for manufacturing the same'20138,476,664'Light emitting diode package having multiple luminescent conversion layers'20138,455,274'Method for manufacturing light emitting diode'20138,373,189'Light emitting diode package'20136,706,519'Devices and methods for the performance of miniaturized in vitro amplification assays'20046,632,399'Devices and methods for using centripetal acceleration to drive fluid movement in a microfluidics system for performing biological fluid assays'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2004Based in Cambridge, MA, US· patent location history
2013–2020Patents assigned to ADVANCED OPTOELECTRONIC TECH (24)· patent assignee history
2013–2015Patents assigned to LIN HSIN-CHIANG (13)· patent assignee history
2013–2014Patents assigned to CHEN PIN-CHUAN (10)· patent assignee history
2013–2015Patents assigned to CHANG CHIEH-LING (3)· patent assignee history
2013–2020Based in Hsinchu, TW· patent location history
2021Patents assigned to BENQ CORP (4)· patent assignee history
2021Based in Taipei, TW· patent location history
2021Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED OPTOELECTRONIC TECH242013–2020
LIN HSIN-CHIANGself132013–2015
CHEN PIN-CHUAN102013–2014
BENQ CORP42021
CHANG CHIEH-LING32013–2015
Locations
LocationPatentsSpan
Hsinchu, TW242013–2020
Taipei, TW32021
Cambridge, Massachusetts, US22003–2004
New Taipei, TW12021