Inventor
Linda L. Rapp
Inventor
Poughkeepsie, NY, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
C03CChemical composition of glasses, glazes or vitreous enamels17%
C04BLime, magnesia17%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
6,900,395'Enhanced high-frequency via interconnection for improved reliability'20056,501,174'Interconnect structure for surface mounted devices'20025,185,215'Zirconia toughening of glass-ceramic materials'19935,173,331'Zirconia toughening of glass-ceramic materials'19925,045,402'Zirconia toughening of glass-ceramic materials'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2005Patents assigned to IBM (5)· patent assignee history
1991–2005Based in Poughkeepsie, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 5 | 1991–2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 5 | 1991–2005 |