Inventor
Youichirou Kawamura
Inventor
Gifu, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
Y10TTechnical subjects covered by former us classification17%
B23KSoldering or unsoldering8%
H01LSemiconductor devices8%
PatentTitleYear
9,480,170'Printed wiring board and a method of manufacturing a printed wiring board'20168,091,766'Method and apparatus for loading solder balls'20128,087,164'Printed wiring board and a method of manufacturing a printed wiring board'20128,083,123'Method for manufacturing a printed wiring board'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2016Patents assigned to IBIDEN CO LTD (4)· patent assignee history
2011–2016Patents assigned to KAWAMURA YOUICHIROU (4)· patent assignee history
2011–2016Patents assigned to TANNO KATSUHIKO (4)· patent assignee history
2011–2012Based in Gifu, JP· patent location history
2016Based in Ibi-gun, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBIDEN CO LTD | 4 | 2011–2016 |
| KAWAMURA YOUICHIROUself | 4 | 2011–2016 |
| TANNO KATSUHIKO | 4 | 2011–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gifu, JP | 3 | 2011–2012 |
| Ibi-gun, JP | 1 | 2016 |