Inventor
Benjamin D. Briggs
Inventor
Waterford, NY, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
G06FElectric digital data processing5%
A63CSkates2%
B01LChemical or physical laboratory apparatus for general use2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
G06KGraphical data reading2%
G07CTime or attendance registers2%
G09BEducational or demonstration appliances2%
PatentTitleYear
11,004,790Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material202110,991,619Top via process accounting for misalignment by increasing reliability202110,985,056Structure and method to improve FAV RIE process margin and Electromigration202110,978,342Interconnect with self-forming wrap-all-around barrier layer202110,978,393Hybrid dielectric scheme for varying liner thickness and manganese concentration202110,971,030Remote physical training202110,964,588Selective ILD deposition for fully aligned via with airgap202110,957,646Hybrid BEOL metallization utilizing selective reflection mask202110,957,584Structure and method to improve FAV RIE process margin and electromigration202110,957,582Self aligned via and pillar cut for at least a self aligned double pitch202110,957,581Self aligned via and pillar cut for at least a self aligned double pitch202110,943,866Method and structure to construct cylindrical interconnects to reduce resistance202110,912,986Dynamic rigidity mechanism202110,916,501Back end of line electrical fuse structure and method of fabrication202110,915,620Paint on micro chip touch screens202110,901,317Extreme ultraviolet (EUV) lithography patterning methods utilizing EUV resist hardening2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to IBM (13)· patent assignee history
2021Patents assigned to TESSERA INC (3)· patent assignee history
2021Based in Waterford, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 13 | 2021 |
| TESSERA INC | 3 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Waterford, New York, US | 16 | 2021 |