Inventor
Larry L. Moresco
Inventor
San Carlos, CA, US
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification13%
G06FElectric digital data processing9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light1%
G06KGraphical data reading1%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes1%
PatentTitleYear
9,639,126'Apparatus for cooling a computer'20178,701,747'Method and an apparatus for cooling a computer'20148,016,023'Method and an apparatus for cooling a computer'20117,490,656'Method and an apparatus for cooling a computer'20097,086,452'Method and an apparatus for cooling a computer'20066,843,421'Molded memory module and method of making the module absent a substrate support'20056,798,076'Method and apparatus for encoding information in an IC package'20046,733,685'Methods of planarizing structures on wafers and substrates by polishing'20046,539,137'Thermo-electric signal coupler'20036,535,398'Multichip module substrates with buried discrete capacitors and components and methods for making'20036,404,047'Socketable BGA package'20026,324,436'Method for optimizing cost of manufacturing memory arrays'20016,223,814'Flexible foil finned heatsink structure and method of making same'20016,221,459'Controlling the heat expansion of electrical couplings'20016,168,976'Socketable BGA package'20016,111,756'Universal multichip interconnect systems'20006,102,710'Controlled impedance interposer substrate and method of making'20006,034,332'Power supply distribution structure for integrated circuit chip modules'20006,026,895'Flexible foil finned heatsink structure and method of making same'20005,930,890'Structure and fabrication procedure for a stable post'19995,916,453'Methods of planarizing structures on wafers and substrates by polishing'19995,897,341'Diffusion bonded interconnect'19995,854,534'Controlled impedence interposer substrate'19985,773,889'Wire interconnect structures for connecting an integrated circuit to a substrate'19985,765,279'Methods of manufacturing power supply distribution structures for multichip modules'19985,722,162'Fabrication procedure for a stable post'19985,655,290'Method for making a three-dimensional multichip module'19975,536,362'Wire interconnect structures for connecting an integrated circuit to a substrate'19965,514,906'Apparatus for cooling semiconductor chips in multichip modules'19965,426,563'Three-dimensional multichip module'19955,404,265'Interconnect capacitors'19955,334,804'Wire interconnect structures for connecting an integrated circuit to a substrate'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2004Patents assigned to FUJITSU LTD (22)· patent assignee history
1994–2004Based in San Carlos, CA, US· patent location history
2001–2017Patents assigned to INTEL CORP (9)· patent assignee history
2005Patents assigned to MATRIX SEMICONDUCTOR INC (1)· patent assignee history
2005–2017Based in Eagle, ID, US· patent location history
2014Patents assigned to MORESCO LARRY L (1)· patent assignee history
2014Patents assigned to SENYK BORYS S (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 22 | 1994–2004 |
| INTEL CORP | 9 | 2001–2017 |
| MATRIX SEMICONDUCTOR INC | 1 | 2005 |
| MORESCO LARRY Lself | 1 | 2014 |
| SENYK BORYS S | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Carlos, California, US | 26 | 1994–2004 |
| Eagle, ID, US | 6 | 2005–2017 |