Inventor
Karl E. Boggs
Inventor
Hopewell Junction, NY, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B24BMachines, devices, or processes for grinding or polishing13%
C09GPolishing compositions10%
C11DDetergent compositions10%
C09KMaterials for miscellaneous applications, not provided for elsewhere8%
C23FNon-mechanical removal of metallic material from surface8%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry4%
B08BCleaning in general4%
F25BRefrigeration machines, plants or systems4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
PatentTitleYear
RE046427'Antioxidants for post-CMP cleaning formulations'20179,528,078'Antioxidants for post-CMP cleaning formulations'20169,522,773'Substantially rigid collapsible liner and flexible gusseted or non-gusseted liners and methods of manufacturing the same and methods for limiting choke-off in liners'20169,132,412'Component for solar adsorption refrigeration system and method of making such component'20159,074,170'Copper cleaning and protection formulations'20159,074,169'Lithographic tool in situ clean formulations'20158,685,909'Antioxidants for post-CMP cleaning formulations'20148,618,036'Aqueous cerium-containing solution having an extended bath lifetime for removing mask material'20138,539,781'Component for solar adsorption refrigeration system and method of making such component'20138,304,344'High throughput chemical mechanical polishing composition for metal film planarization'20128,236,695'Method of passivating chemical mechanical polishing compositions for copper film planarization processes'20127,736,405'Chemical mechanical polishing compositions for copper and associated materials and method of using same'20107,361,603'Passivative chemical mechanical polishing composition for copper film planarization'20087,300,601'Passivative chemical mechanical polishing composition for copper film planarization'20076,857,434'CMP slurry additive for foreign matter detection'20056,325,696'Piezo-actuated CMP carrier'20016,296,717'Regeneration of chemical mechanical polishing pads in-situ'20016,106,374'Acoustically agitated delivery'20006,102,776'Apparatus and method for controlling polishing of integrated circuit substrates'20006,087,191'Method for repairing surface defects'20005,972,787'CMP process using indicator areas to determine endpoint'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2013Patents assigned to IBM (8)· patent assignee history
1999–2000Based in Poughkeepsie, NY, US· patent location history
2001–2017Based in Hopewell Junction, NY, US· patent location history
2007–2017Patents assigned to ADVANCED TECH MATERIALS (12)· patent assignee history
2010Based in Hopewell Jct., NY, US· patent location history
2012–2015Patents assigned to BOGGS KARL E (5)· patent assignee history
2013–2016Patents assigned to BOGGS KARL (3)· patent assignee history
2015–2017Patents assigned to ENTEGRIS INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED TECH MATERIALS | 12 | 2007–2017 |
| IBM | 8 | 1999–2013 |
| BOGGS KARL Eself | 5 | 2012–2015 |
| BOGGS KARLself | 3 | 2013–2016 |
| ENTEGRIS INC | 3 | 2015–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hopewell Junction, New York, US | 16 | 2001–2017 |
| Poughkeepsie, New York, US | 4 | 1999–2000 |
| Hopewell Jct., New York, US | 1 | 2010 |