Inventor
Daniel T. Rooney
Inventor
Schaumburg, IL, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections22%
H05KPrinted circuits22%
Y10TTechnical subjects covered by former us classification22%
C23CCoating metallic material11%
G01NInvestigating or analysing materials by determining their chemical or physical properties11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
PatentTitleYear
7,434,310'Process to reform a plastic packaged integrated circuit die'20087,390,978'Overmolded electronic assembly and overmoldable interface component'20085,825,633'Multi-board electronic assembly including spacer for multiple electrical interconnections'19984,971,853'Laser directed chemical vapor deposition of transparent metal films'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990Patents assigned to UNIV SYRACUSE (1)· patent assignee history
1990Based in Liverpool, NY, US· patent location history
1998–2008Patents assigned to MOTOROLA INC (3)· patent assignee history
1998–2008Based in Schaumburg, IL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 3 | 1998–2008 |
| UNIV SYRACUSE | 1 | 1990 |
Locations
| Location | Patents | Span |
|---|---|---|
| Schaumburg, Illinois, US | 3 | 1998–2008 |
| Liverpool, New York, US | 1 | 1990 |