Inventor
Mitsuyoshi Endo
Inventor
Yokohama-shi, Kanagawa, JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10HInorganic light-emitting semiconductor devices having potential barriers9%
H05KPrinted circuits5%
Y10TTechnical subjects covered by former us classification5%
C04BLime, magnesia2%
G01RMeasuring electric variables2%
H01GCapacitors2%
H01QAntennas, i.e. radio aerials2%
PatentTitleYear
10,170,352Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor device20199,887,328'Semiconductor light emitting device and method for manufacturing same'20189,755,127'Semiconductor light emitting device and method for manufacturing same'20179,735,325'Semiconductor device and manufacturing method of semiconductor device'20179,595,631'Semiconductor light emitting device and method of manufacturing the same'20179,543,484'Semiconductor light emitting device and method for manufacturing same'20179,312,207'Semiconductor device'20169,229,052'Stack including inspection circuit, inspection method and inspection apparatus'20169,209,097'Substrate bonding method and substrate bonding apparatus'20159,123,717'Semiconductor device manufacturing method and manufacturing apparatus'20158,884,396'Semiconductor device and manufacturing method thereof'20148,766,407'Semiconductor wafer and laminate structure including the same'20148,427,808'Variable capacity element'20138,324,715'Semiconductor device and method of manufacturing the same'20127,768,456'Antenna device and radio communication device'20107,370,412'Method for connecting electronic device'20087,095,112'Semiconductor device, semiconductor package member, and semiconductor device manufacturing method'20066,861,738'Laminated-chip semiconductor device'20056,617,678'Semiconductor device'20035,969,413'Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads'19995,703,397'Semiconductor package having an aluminum nitride substrate'19975,176,309'Method of manufacturing circuit board'19934,770,953'Aluminum nitride sintered body having conductive metallized layer'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–2018Patents assigned to TOSHIBA KK (20)· patent assignee history
1988–2019Based in Yokohama-shi, Kanagawa, JP· patent location history
1993Based in Tokyo, JP· patent location history
1997–1999Patents assigned to TOKYO SHIBAURA ELECTRIC CO (2)· patent assignee history
1997Based in Ebina-shi, JP· patent location history
1999Based in Ebina, JP· patent location history
2008–2016Based in Kanagawa, JP· patent location history
2012–2014Patents assigned to ENDO MITSUYOSHI (4)· patent assignee history
2019Patents assigned to ALPAD CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 20 | 1988–2018 |
| ENDO MITSUYOSHIself | 4 | 2012–2014 |
| TOKYO SHIBAURA ELECTRIC CO | 2 | 1997–1999 |
| ALPAD CORP | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama-shi, Kanagawa, JP | 15 | 1988–2019 |
| Kanagawa, JP | 5 | 2008–2016 |
| Ebina, JP | 1 | 1999 |
| Ebina-shi, JP | 1 | 1997 |
| Tokyo, JP | 1 | 1993 |